View the full schedule in detail here.

Continuing the tradition of focusing on the practical aspects of the power electronics profession, the Professional Education Seminars at APEC 2019 address the need for in-depth discussion of important and complex power electronics topics.  Each seminar combines practical application with theory designed to further educate the working professional in power electronics or related fields.  The Professional Education Seminars at APEC are three-and-one-half hours (including breaks) in length, can range from broad to narrow in scope, and can vary from introductory to advanced in technical level and they complement the technical papers, the special presentations, and the comprehensive exposition.

Seminar Schedule

Track Session One Session Two Session Three
Sunday, March 17, 2019 Sunday, March 17, 2019 Monday, March 18, 2019
9:30 - 13:00 14:30 - 18:00 8:30 - 12:00
Components Design & Integration of WBG Solid State Circuit Protection Magnetic Design Fundamentals - What They didn't Tell You

Latest Trends in Magnetic Technology for High Efficiency and High Power Density

Douglas Hopkins, Bahji Ballard George Slama Ionel Jitaru
NC State University, NC, USA Würth Electronics Rompower Energy Systems Inc., United States
Control Advances In Modeling And Simulation For Magnetics And Control A Comprehensive Introduction to Digital Control for Power Electronic Converters Systematic Approach to Control of Electrical Drives and 3 Phase Converters
Ray Ridley Joel Steenis, Alex Dumais Tony O'Gorman, Vladimir Blasko
Ridley Engineering, US, United States Microchip PESC, UTRC
Design Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Thermal Design of Power Electronics Fundamentals of Design for Reliability in Power Electronics
Vernon Solberg Lauren Boteler Frede Blaabjerg, Francesco Iannuzzo, Huai Wang
Solberg Technical Consulting U.S. Army Research Laboratory Aalborg University, Denmark
High-Power Applications Design Issues for High Power and High Performance SiC Converters High Power and Medium Voltage Applications of Wide Bandgap Power Devices Electric Powertrain: Energy Systems, Power Electronics and Drives for Hybrid, Electric and Fuel Cell Vehicles
Jiangbiao He, Juan Sabate, Michael Schutten, Yash Veer Singh, Zheyu Zhang Jin Wang, Mark Scott John Hayes, Abas Goodarzi
GE Global Research Center, USA The Ohio State Univ, OH, USA; Miami Univ., OH, USA Univ. of Cork, Ireland; US Hybrid, USA
Topology and Circuits Hybrid and Resonant Switched-Capacitor Converters: New Circuit Topologies and Control Techniques for High Power Density Designs Modular High Frequency High Voltage Power Supply: Architectures, Unified Modeling Methodologies and Output Voltage Sharing Technologies Simulation and Analysis Applied to the Design of Buck Topologies
Robert Pilawa Saijun Mao, Braham Ferreira Christophe Basso
U.C. Berkeley, USA Leaddrive Technology, China; Delft Univ. of Technology, Netherlands ON Semiconductor, France
Wide Bandgap WBG Device Characterization for Converter Design: Challenges and Solutions Ten most commonly asked questions on migrating from Si to SiC MOSFET based converter designs What Makes SiC Better and How Do I Change My System to Benefit
Edward Jones, Zheyu Zhang, Fred Wang David Levett, Kwokwai Ma, Min Fang Xuning Zhang
EPC, CA, USA; GE Global Research, NY, USA; University of Tennessee at Knoxville, TN, USA Infineon, USA; Infineon, China; Infineon, USA;  Monolith Semiconductor, TX, USA



Topics are to address the practical issues of the specification, design, manufacture and marketing of power electronic components, products, and systems. Proposals focusing on, but not limited to, any of the following areas of power electronics are welcome.

  1. AC-DC Power Supplies
  2. DC-DC Converters
  3. Inverters
  4. Power System Architectures
  5. Lighting Power Systems
  6. Renewable/Alternative Energy
  7. Aerospace & Defense Systems
  8. Automotive & Traction Applications
  9. Telecom Power Systems
  10. Uninterruptible Power Supplies
  1. DESIGN (continued)
  1. Protection of Converters & Systems
  2. Safety and EMI/EMC Compliance
  3. Simulation Tools & Techniques
  4. Soft-Switching Techniques
  5. Thermal Management




  1. Capacitor Technologies
  2. ICs for Power Electronics
  3. Magnetics
  4. Power Semiconductors
  1. Design for Manufacturability
  2. High Density Packaging
  3. Manufacturing Processes
  4. Standardizing Specifications
  5. Technology Transfer
  1. Control of Converters & Systems
  2. Digital Control and Management
  3. EMI and EMC Issues
  4. Energy Harvesting
  5. High-Efficiency Designs
  6. High-Frequency Designs
  7. Machine Control
  8. Modeling and Analysis
  9. Power Conversion Fundamentals
  10. Power Factor Correction
  1. Benchmarking Results
  2. Identifying New & Emerging Markets
  3. JIT & Material Management
  4. Market Analysis & Strategies
  5. Procurement & Qualification
  6. Product & Technology Roadmaps
  7. Quality/Reliability and Data
  8. The Voice Of The Customer


Please note the following time frames (subject to change and posted at here):

July 2, 2018          Start date to submit proposal
September 14, 2018 Deadline for proposal submission
October 26, 2018 Notification that a proposal was accepted or declined
October 26, 2018 -
January 11, 2019 
Final presentation and author registrations are due

Preparation of proposals

The seminar proposal should include the following:

  • Contact information for presenting speaker(s): name, affiliation, mailing address, telephone number, and email address. The corresponding presenter must be clearly identified, and an email address must be provided in the proposal.
  • An abstract of no more than 200 words describing what is to be presented, including whether the topic will be treated in-depth or as a survey, and the level of the intended audience (entry level, intermediate, or advanced). This abstract should be in a form suitable for publication in the APEC advance program.
  • A detailed topical outline of three to five double-spaced pages including the estimated time for each major topic. Note that the topics must be suitably in-depth and comprehensive to adequately cover three plus hours of presentation time.
  • A short biography (<200 words) and a résumé/CV of each speaker.

Procedure and important notices

  • Members of the APEC Conference and Program Committees will review the seminar proposals. Seminars are selected based on high quality and an effort to provide a balanced seminar program consistent with the overall APEC charter. This means that that some very good seminar proposals may be declined.
  • Compensation for seminar speakers includes an honorarium of US$2500.00 and a complimentary seminar and conference registration. In the case of multiple speakers for one seminar, the US$2500.00 honorarium and complimentary registrations may be shared among the speakers. Seminar speakers are responsible for their own expenses of preparing and presenting the seminar, including all travel, lodging, and meals.
  • Speakers are required to be present at APEC 2018 to deliver their presentation in person.
  • Tutorial presentations are expected to be commercial free. Limit background information on the speaker’s affiliation and trademarked terms.  Part numbers and detailed product information should be avoided unless necessary for the tutorial.
  • The seminar presentations will be distributed as protected Adobe PDF files (text and graphics copy protected) in the USB flash drives as well as printed handouts, which will be in color. Submission of your seminar proposal serves as your implicit agreement and consent to electronic distribution of your seminar presentation.
  • Final presentations in Microsoft PowerPoint format AND Adobe PDF format are due at the APEC office no later than January 11, 2019.

To access the seminar presentation files from APEC 2018, click here.