About Professional Education Seminars
APEC Professional Education Seminars focus on practical aspects of the power electronics profession and provide in-depth discussion of important and complex power electronics topics. Seminars combine practical application with theory, and are designed to further educate the working professional in power electronics. Content will be recorded and presented on demand.
APEC 2021 Professional Education Seminar Schedule
Conference Schedule | Registration
Following is the professional education seminar content for APEC 2021.
| Track | Session One | Session Two |
| Times and Dates to Come | Times and Dates to Come | |
| Circuits & Topologies | Hybrid and Resonant switched-Capacitor Power converters: New Circuit Topologies and Control Techniques for High Power Density Designs | New Developments in Topologies and Magnetics to Reach 99% Efficiency Using the Latest Semiconductor Devices |
| S01 | S09 | |
| Robert Pilawa-Podgurski | Ionel Jitaru | |
| University of California, Berkeley, US | Rompower Energy Systems Inc. | |
| Components I | Selecting the Best Power Semiconductor Device for Your Application | Isolated Gate Driver ICs in Power Electronics Systems – Insulation specifications, IC verification, Application Requirements and Design Optimization |
| S02 | S10 | |
| David Levett, Thomas Laska | Wei Zhang | |
| Infineon Technologies, USA/Germany | Texas Instruments, USA | |
| Components II | Integrated PCB Winding Magnetic Components for High Frequency Power Converters | Practical Considerations for the Application of High Power Si and SiC Modules |
| S03 | S11 | |
| Qiang Li, Fred Lee | John Donlon, Eric Motto | |
| Virginia Tech, USA | Mitsubishi Electric, USA | |
| Control & Design | Designing Compensators for the Control of Switching Power Supplies | Traditional and Emerging Digital Control Techniques in Power Electronics |
| S04 | S12 | |
| Christophe Basso | Waqar Khan, Nathan Weise, Armin Ebrahimian | |
| ON Semiconductor, France | Marquette University, USA | |
| EMI | EMC Design Fundamentals for Power Electronics Converters | Silicon Carbide (SiC) Power Converters: EMC Design Fundamentals, Layout Techniques, and Construction Methods |
| S05 | S13 | |
| Ilknur Colak | Michael Schutten, Cong Li, Predrag Hadzibabic | |
| Maschinenfabrik Reinhausen GmbH, Germany | Schutten Technical Consulting, LLC, USA; GE Global Research Center, USA; GE Aviation Systems, USA | |
| Motor Drives & Reliability | Reliability Analysis Methods and Tools for Power Electronic Components and Systems | Fundamentals of Switched Reluctance Motor Drives |
| S06 | S14 | |
| Frede Blaabjerg, Huai Wang, Ionut Vernica | Babak Fahimi | |
| Aalborg University, Denmark | University of Texas at Dallas, USA | |
| Wide Bandgap II | Future Power Electronics 4.0 SiC/GaN 3-phase PWM Converter Concepts | A Practical Guide to SiC MOSFET and Schottky Applications |
| S07 | S15 | |
| Johann W. Kolar, Jonas E. Huber | Paul Schimel | |
| ETH Zurich, Switzerland | Microchip, USA | |
| Wide Bandgap II | SiC Power Conversion and System Packaging Technologies for High Temperature High Pressure Harsh Environment Applications | Maximizing GaN FET and IC Performance |
| S08 | S16 | |
| Saijun Mao, Braham Ferreira | Michael Derooij, John Glaser, Alex Lidow | |
| Fudan University, China; University of Twente, The Netherlands | Efficient Power Conversion (EPC), USA |