Exhibitor Seminars

APEC 2018 showcases Exhibitor Seminars that highlight new products or intiatives that companies in the power electronics industry are developing, along with allowing the opportunity for attendees to interact with other companies in the industry. Please continue to check the website, as information will be added on an ongoing basis.

Tuesday, March 6, 2018 | 13:30 - 14:00
Company Session Title Speakers Description Room

Latest Saber Modeling and Simulation Features for Power Electronics

Alan Courtay

The Synopsys Saber simulator continues to address the need for accurate and efficient models in power electronics. The library of Saber power MOSFET tools has recently been extended to cover a wide range of manufacturers and technologies including Silicon Carbide and Gallium Nitride. Lessons learned from characterizing devices based on datasheets and an assessment of the quality of SPICE models from various manufacturers will be shared. In addition, the latest Saber release introduces a new battery modeling tool focused on Lithium-Ion chemistries and a faster periodic AC analysis (PAC) to characterize switch mode power converters in the frequency domain. A peek at the upcoming Saber BJT modeling tool will also be given.


The Path to Predictable, High-Volume, High-Yield Manufacturing of SiC Devices

Corey Deyalsingh (Littelfuse), Andy Wilson (X-Fab), Sujit Banerjee (Monolith)

Making the next generation of silicon carbide (SiC) devices like MOSFETs and Schottky diodes more affordable depends on the ability to produce them in high volumes with high yields predictably. The first steps on the path toward this goal have been making the transition from 3 inch and 4-inch SiC wafers to 6-inch SiC wafers and developing design and process techniques that are compatible with processes in a silicon CMOS fab. More than 90 percent of SiC device processes are compatible with processes already available in a silicon CMOS fab. Integrating the process flows for silicon and SiC wafers and running them in parallel offers chip producers enormous economies of scale. This approach has already proven successful in the production of 1200 V SiC MOSFETs and Schottky diodes in an automotive-qualified 150 mm CMOS fab owned by X-FAB Silicon Foundries. The devices produced are not only highly manufacturable but display superior device performance, gate oxide reliability, and robustness.


Practical Considerations with Core Geometry in Inductor Design and New Products

Sam Davis

Magnetics will be presenting on both our latest materials and products as well as up and coming products to be released in the near future. We will also be continuing our study of core geometry and how that impacts core performance. Last time, cores of various geometry, size and permeability were tested using a standardized testing method used by Magnetics in order to find offsets in core performance. This time, inductors using a variety of core geometries will be designed to a specific inductance under load to further distinguish offsets in performance and to compare with last year’s findings. The cores chosen for the study all have a similar inductance factor which will act as a constant for the study since that parameter is only dependent on geometrical properties given the same material and permeability.

Power Integrations

Digitally-Controlled Off-Line Flyback that Exceeds DOE (6) Efficiency for Wide Range and USB PD Power Supplies

Amruta Patra

Synchronous rectification and quasi-resonant operations are well known techniques for increasing power supply efficiency. Achieving high efficiency with a highly variable output voltage is substantially more difficult due to transformer optimization, reflected voltage limitations and SR FET timing constraints. This presentation describes a 40 W off-line flyback power supply design that maintains flat efficiency across the load range, meeting all international standards for power supply efficiency. The presentation will cover power stage and magnetics design, implementation of the  control interface and EMI optimization for open frame applications, field configurable power, and adapters requiring USB PD with PPS compliance.

Mouser Electronics Robust Piezo Actuator Solution for Innovative HMI Haptic Feedback Matt Reynolds (EPCOS), Kelly Griffin (Texas Instruments)

The new PowerHap™ piezo actuator with haptic feedback and integrated sensor functionality from TDK Corporation is a compact and innovative actuator that significantly enhances the sensory experience of the human machine interface. The PowerHap Piezo actuator is robust and powerful enough to operate in hostile, low-visibility and noise-filled environments. With integrated sensors, the actuator features unrivalled performance in terms of acceleration, force and response time, and thus offers an unprecedented quality of haptic feedback. The presentation will also discuss haptic feedback trends and how multilayer piezo plate technology can increase the user experience while remaining cost-effective. 

Coilcraft Power Inductor Trends Len Crane

Coilcraft introduces power inductors optimized for high frequency switching, high ripple current, and high power density.  This presentation discusses the new high-performance materials and features of these inductors.  New Coilcraft inductor families include XEL for high frequency, XTL for high inductance, SRT for high current and power density, and XAR designed for integrated packaging. This presentation will demonstrate how these inductors meet the challenges of today’s changing technologies and applications.         

Panasonic Gate driving method and new application for exceeding the Si limite with X-GaN. Tom Higuchi

Let’s start discussion of GaN implementation since X-GaN qualified proper reliability. You can see that the X-GaN’s gate drive method is not difficult, after this seminar. You will discern how to drive X-GaN using generic Gate Driver IC. The importance of schematic and routing are defined in order to be maximized the benefit of X-GaN high performance. The suitable topology and application for X-GaN are illustrated. Expansion to Power Supply, AC-Adapter and Inverter is expected in the future. Don’t miss next industry standards coming within reach of your hands.

Navitas Semiconductor GaNFast to Higher Efficiency Dan Kinzer

GaN’s device-level performance is 5-10x better than that of Si for key switching and loss figures of merit. This offers a benefit in hard-switching topologies but the real value is to use monolithic integration of FET, drive and logic to operate 5x, 10x or 20x faster in soft-switching circuits. GaN Power ICs exploit not only GaN’s advances like RDS(ON) QG, QOSS, QRR, but also cut losses by enhancing switching speed and improving gate control. A study of PFC reference designs ranging in power from 100 W to 3.2 kW, with CrCM boost, Totem-Pole and interleaved topologies, and switching frequencies from 100 kHz to 1MHz is presented.

Tuesday, March 6, 2018 | 14:15 - 14: 45
Ltec Corporation

Predict wide bandgap power device technology trends through teardowns, and deep analysis.

Louis Burgyan 

Analyze the past to predict future trends and gain competitive edge! Having examined hundreds of devices, LTEC engineers identify essential construction details of SiC and GaN semiconductor technologies and link specific findings obtained from physical device de-construction, materials, and electrical analysis to key performance parameters and potential reliability concerns.  Attributes essential to achieving high temperature operation and improved short-circuit survival are revealed. Various technologies and associated scaling trends are discussed, including their impact on performance and cost.  This presentation offers “hard to access” knowledge base essential to the development of power electronic systems.

SIMPLUS Technoligies, Inc.

Design Verification using Monte Carlo, Sensitivity, and Worst-Case Analyses in SIMPLIS

Matthew Fortin and John Wilson

As the pressure to reduce design cycle time builds, the use of simulation to highlight and expose design flaws before building the first prototype becomes essential. In this seminar, we begin a process of design verification first employing the time-tested Monte Carlo analysis. Next, we perform sensitivity and worst-case analyses using standard built-in Design Verification Module (DVM) functions. Finally, we show how to automatically change schematic component values to use statistical distribution functions from the sensitivity tolerance definitions, including those of circuit elements that employ SIMPLIS’ new ability to describe the digital behavior of a SIMPLIS subcircuit with user-defined C/C++ code.


Reference Designs Kick Start Reliable High-voltage GaN Application Development

Philip Zuk, Vice President of Technical Marketing, Transphorm

The power electronics industry’s adoption of high-efficiency, high-reliability Gallium Nitride (GaN) is increasing. Yet, to many engineers developing power systems, GaN remains a new technology presenting new design challenges. Transphorm stands as one of the only high-voltage GaN manufacturers with customer products in production. Based on those projects as well as its own R&D, Transphorm holds a unique understanding of effective design methods that properly leverage GaN for optimal performance and system lifespan. Transphorm now extends that knowledge to engineers via various reference designs. Learn how to kick start your high-voltage application designs with Transphorm, and join the GaN Revolution! 


United Chemi-Con Inc 

Advanced DC Link Capacitor for 48V inverter of MHV

Tony Olita/Toshihiko Furukawa

The life requirement of DC Link capacitors mounted on the invertor is one of key parameter to maintain the inverter efficiency.  Less efficiency of the inverter because of the degradation of the capacitors will impact on reducing of MPG and increasing of CO2.   In this seminar, the life requirement for DC-Link Capacitor and the life prediction with multiple types current profiles under the typical temperature profile will be presented.   Also, advanced DC-Link capacitor products line up will be presented.



Digital combo multi-mode PFC and time-shift LLC resonant Controller

Rosario Attanasio

STNRG011 is a new digital controller in an O20 package that includes a multi-mode (transition-mode and DCM) PFC controller, a high voltage double-ended controller for the LLC resonant half-bridge, an 800 V-rated startup generator and a sophisticated digital engine, that manages the optimal operation of the three blocks. The digital algorithms are stored into an internal ROM memory while a programmable NVM (non volatile memory) allows a wide configurability and calibration of the key parameters for applications .


RTDS Technologies Inc

Real Time Simulation: The Essential Tool for Both Low and High Power Applications 

Dr. Ehsan Tara

Power electronics-based high power conversion systems are an integral part of our power system. A typical step in the development of these high power conversion systems is the testing of the controller. If the rating of the system is reasonable (in the kW range), it is common to use a real system for testing both the power stack and the control system. However, the trend from industry is larger and riskier each day, with HVDC ratings in the hundreds of MW or even GW range. These systems are impractical to test with physical replicas. Additionally, these systems are meant to be interfaced with an existing utility grid, containing many elements with their own characteristics. Closed-loop testing with the RTDS Simulator has been established as the de facto method for testing the controls of these high power systems for more than 20 years, with the RTDS Simulator used for the Factory Acceptance Testing for most major HVDC and FACTS projects. Real time simulation offers a highly flexible and accurate solution for simulating not only the power stack and power electronics in question, but also the interconnected AC system. This presentation explores the importance of real time simulation in these areas and gives some real world examples of the benefits.



Integrating PSIM & SPICE for Device Level and System Level Simulation 

Albert Dunford

The new PSIM release includes a built-in SPICE engine and support for LTspice simulation, with support to SiC/GaN models. While PSIM excels in system level and control simulation, SPICE is great in device level simulation. The combined platform makes the best use of both engines in a complementary way. In addition, PSIM provides the dual-model definition functionality, making the transition seamless between PSIM and SPICE simulation.  With SPICE integration, PSIM is now a one-stop solution for all your simulation and design needs, including power supplies, motor drives, analog & digital control, loss calculation, and DSP code generation.


Adaptive Power Systems

Regulatory Power Compliance testing made easy

Herman van Eijkelenburg

AC power products that operate on utility power must be designed to withstand power grid fluctuations and anomalies that can occur on most grids. This is especially true for CE marked products destined for the European market at CE marking implies meeting a variety of AC power related IEC 61000-4 immunity test standards as part of the EMC requirements. This session will illustrate the built-in IEC 61000-4 test capabilities of modern day programmable AC power source that allow design engineers to perform pre-compliance testing during product development, greatly increasing the chances of the product passing these requirements and avoiding costly late-in-life design changes.

Tuesday, March 6, 2018 | 15:00 - 15:30

Abstract Power Electronics

Primate Power™ Sources UseSiC Devices to Improve Efficiency & Response Time

Jeff Reichard

High efficiency, high bandwidth power sources are what engineers need in the labs and what OEMs can use to improve products.  Primate Power™ achieves this and more with the use of SiC devices.  Reduced losses allow for higher switching speeds that improve load and source management.  The Primate Power™ Sources are compact, rugged and versatile with power ranges of 4 kW through 300 kW and voltages up to 690 VAC / 1200 VDC.  Abstract Power Electronics introduces the power source that is ideal for testing batteries and high-speed motors, simulating grids, and much more.


OPAL-RT Technologies

How to Use Real-Time Simulation for a Better, Modern, and Interactive Teaching Experience for Power Electronic and Electric Motors

Christophe Brayet

This topic demonstrates how to use Real-Time Simulation for a Better, Modern, and Interactive Teaching Experience for Power Electronics and Electric Motors. Real-time simulation laboratories are introduced here to enhance the teaching experience and add the “User-In-The-Loop” concept. Students interact with real equipment and the simulated systems in real-time via a panel and the “user-interaction-bandwidth” is taken into account. This allows for a better understanding of phenomena, and a visualization of critical system behaviors without the worry of damaging physical material. Universities around the world are rapidly adopting HIL technology in their programs in order to leverage their engineering education. Based on years of research and experience in power electronics and power system, and listening to the users' needs, OPAL-RT offers Hardware-in-the-Loop (HIL) and Rapid Control Prototyping (RCP) Teaching Laboratories to universities in an efficient, reliable and affordable way.


Helix Semiconductors 

Helix Semiconductors – A New Breed of Energy-Efficient Power Supply Solutions

Harold A. Blomquist

With electricity grids around the globe burdened to the brink of failure, massive energy shortages being predicted (due to all of the connected devices on the internet of things), multiple government entities enacting strict energy efficiency standards, and vampire loads wasting more than $80 billion per year, the time is now to address the way power conversions are being made. Helix Semiconductors is focused on addressing the global initiatives for more efficient power supplies through its core energy-efficiency technology (MuxCapacitorTM), which takes a different approach to power conversion than traditional methods.  Over the entire load range, from low-load to full-load conditions, Helix’s MuxCapacitor converts mains power worldwide to virtually any lower voltage with over 95% efficiency. Helix’s technology enables the highest power density through capacitive power conversion and capacitive isolation. This capacitive conversion voltage-reduction technology makes possible best-in-class energy conversion efficiencies across the full load range, and especially while the system is in power down (standby and vampire power) and lightly loaded operation. Applications that will benefit from Helix’s MuxCapacitor technology include everything from IoT sensors and gateways – and all of the things they connect – to external power adapters and chargers, white goods user interfaces, wireless access points, VoIP phones, telecom and data center line cards, electric vehicles, solar converters, and more.



Professional Capacitor Solutions for severe conditions: New approaches for dealing with the reduction of parasetic inductances, improved humidity resistance and dedicated automotive projects.

Dr. Thomas Ebel

FTCAP capacitors are used in many products where a layperson would not expect them at all. For example, they are an integral part of autonomous defibrillators, hybrid race cars, solar ships and computer tomographs. Uninterrupted power supplies are another example. An important area is medical technology. Currently there is large potential in renewable energies – capacitors are installed for example in wind turbines and photovoltaic systems and are increasingly in demand in view of the energy transition. The same applies to the large growth market for electromobility. The presentation provides information on the potential applications of FTCAP capacitors in different industries.


Alpha and Omega Semiconductor Inc.

Latest Technology for High-Efficiency Power Conversion

Peter H. Wilson 

Power conversion is an essential element in today's society from cloud computing to mobile devices. Higher efficiency demands are pushing power technology. AOS offers a full line of power technology from discrete devices (MOSFET, IGBT, and GaN), integrated solutions such as Power IC, and digital power to enable innovative solutions. 


Nichicon (America) Corp

What Hybrid Capacitors Can Do For You

Mark Gebbia

Nichicon Corporation has introduced a new line of Conductive Polymer Hybrid Electrolytic Capacitors that will allow designers to develop smaller more compact products.  Hybrid Capacitors are ideal for applications where standard polymers or aluminum electrolytics are not the ideal choices.  Polymer Electrolytics are great for increased current capabilities and longer life in smaller case sizes, but have limitations that prevent them from being widely accepted. Hybrid capacitors address these issues making them ideal for applications where polymer or aluminum electrolytics are not acceptable. This seminar will highlight the advantages hybrid aluminum electrolytic capacitors have compared to standard aluminum electrolytic and aluminum polymer capacitors. We will demonstrate how hybrid capacitors have characteristics of both aluminum electrolytic and polymer capacitors.


Infineon Technologies

New Gate-Driver IC with excellent ground-shift robustness

Hubert Baierl

In conventional low-side gate-driver ICs, high current transients may cause ground shift potential between the driver IC and controller IC, causing false triggering or failure of the gate-driver IC. Infineon Technologies is announcing a robust and small size solution to this common problem. This new driver IC features a true differential input, to isolate the input stage from common mode ground shifts and enhance switching speed as well as reliability in hard-switching applications, especially when using MOSFETS with kelvin source packages or in low-cost PCBs with long distance between the gate-driver IC and the control IC.



Safety and Reliability for Power Electronics

Kian Sanjari

Session presents Mersen’s commitment to develop industry-leading technologies to improve efficiency and reliability of power electronics equipment. Key topics include an Overview of Fast Acting Power Semiconductor Protection Fuses, plus an introduction to innovative hybrid DC overcurrent protection devices for EV applications. We will explain how Air and Liquid Cooling solutions provide thermal protection for semiconductor components and that efficient cooling is key to long term reliability and performance of fast switching semiconductor components. We will also present how Laminated bus bars provide the most efficient connection between various components, thus limiting parasitic inductance, improving ease of assembly and integration while minimizing wiring errors and costs.

 Tuesday, March 6, 2018 | 15:45 - 16:15

Pin Shine Industrial Co., Ltd.

Transformer Applications: Research on overmolding technics of composite materials

Leo Liou

The main design concept of overmolding is to integrate insert-molding technology to combine the substrate and composite materials through second molding or multiple molding process. The advantages are as following: overmolding process can be used to different materials; including copper wire, silicone steel, core, metal shell and other composite items. Overmolding process increases the distance of the creepage and enhances product performance requirement within a limited space. Overmolding parts have waterproof and dustproof properties; while engineering plastic has high temperature, chemical (oil) and hydrolysis resistance properties. By combining these properties, it allows overmolding products to work in harsh environments.


Ridley Engineering, Inc. 

Prototype In 1 Day With SwitchBit®

Dr. Ray Ridley

Generating the first working prototype with full power and custom magnetics takes months of trial and error. What if you could reduce this process to just one day? In this seminar, we will demonstrate our combined approach. Learn how we use advanced software, specialized high-frequency prototyping boards, and unique measurement tools to achieve the fastest working prototype results in the industry.


CogniPower, LLC

Pushing Flyback Converters Above 65 Watts and the PFC Question

Tom Lawson

Modern flyback converters are efficient and cost-effective to well over 100 Watts. Power Factor Correction is required in many higher power applications. Alternative techniques are considered for Power Factor correction with a focus on the CogniPower Compound Converter for low cost, high efficiency and near-ideal Power Factor Correction


Hoi Luen Electrical Manufacturer Co., Ltd.

Mighty solutions of Fully Insulated Wire (FIW) and the Insulation System

Calvin Ku

Fully Insulated Wire (FIW) with high thermal class, extremely thick high voltage layer and zero-defect insulation compliance with IEC 60317 and 60950, is the next generation wire for miniaturized transformers at lower cost and higher insulation resistance. Embracing high thermal class, very small overall diameters, tight bending radii and high level flexibility, it’s the best alternative to substitute traditional triple insulated wire. 


NH Research, Inc. (NHR)

NHR's New AC & DC Regenerative Source/Loads

Martin Weiss

NH Research is an industry-leading test equipment manufacturer exhibiting a number of our regenerative test solutions including grid-simulators, AC Sources, 4-Quadrant AC Loads, and Battery Emulators.  Regenerative systems save money as they reduce the daily operating costs associated with product testing. This session covers key selection factors, common applications, built-in measurement features, and performance characteristics of these types of testing instruments giving engineers and laboratory managers the information required and confidence that the right testing solution is selected for their application testing needs.


SBE, Inc.

Advanced Developments for high temperature, high efficiency, and greater working voltages of capacitors

Michael Brubaker

Next generation power converters require high performance capacitors and bus structures in the enabling “ecosystem” for both advanced silicon and silicon carbide devices.    High power applications demand increased efficiency, which requires a very low inductance DC link to enable fast switching at maximum DC voltage.   Note that paralleling of switch modules is often necessary to achieve the desired current rating and inductance, which requires a fully integrated capacitor/bus.   DC link capacitors must also shift to higher operating temperatures to reduce the cost and volume of cooling infrastructure. Finally, increasing device voltages to further improve efficiency requires higher voltage DC link capacitors. SBE has developed answers to all of the capacitor needs outlined above.   SBE pioneered the fully integrated capacitor/bus approach with proprietary technology for surface mounting of optimal form factor capacitors directly to bus structures with demonstrated commutation inductances of less than 5nH. SBE has partnered with DuPont Teijin films to address the high temperature film capacitor gap with a solution that can operate at 150C hotspot using their PEN HVTM material.  Finally, the unique SBE Power Ring form factor supports higher voltage applications where very light metallization strategies can be utilized without creating excessive equivalent series resistance. 


InnoCit LLC

Advanced WBG-based Converters

Mehdi Ferdowsi

This seminar covers some of the challenges that power electronic engineers face once they start working with wide bandgap devices.  Some of the advantages of GaN switches are lower specific RDS(on), faster switching, lower gate drive voltage, reduced gate charge, lower parasitic capacitances and inductances, and zero reverse recovery.  Therefore, they offer higher switching frequency, higher efficiency, and smaller footprint.  Despite their many advantages, several challenges lie in the deployment of such devices. 


Wednesday, March 7, 2018 | 10:30 - 11:00

Richardson RFPD

Biasing your gates – How to simplify your power switching applications with RECOM DC/DC converters

Matthew Dauterive, Justin Hill, Peter Victoria

Controlling power switching transistors requires specific voltages to be applied to the gate of the transistor. The required voltage will depend on the chemistry of the transistor – IGBTs for example, typically require +15V across the gate to “turn on” the transistor. In many applications, unwanted turn-on of the gate because of the Miller capacitance can occur, and often the most practical method to prevent this is to apply a negative voltage to the gate. For many IGBTs, the ideal value is -9V. This means that for a half-bridge configuration where there is a high-side and low-side transistor, four separate power supplies would be necessary. With RECOM’s asymmetric output DC/DC converters, this reduces the need to only two power supplies. RECOM has high-isolation, asymmetric DC/DC converters for IGBT (+15V/-9V) and SiC (+20V/-5V & +15V/-3V). RECOM also has high-isolation converters for the latest GaN transistors which typically only require a single 6V supply for the gate. RECOM has also introduced a new reference design (R-REF01-HB) that will allow designers to evaluate different types of transistors to find the best fit for their application. The designer can solder either TO247-3L or TO247-4L transistors of their choice to the board and the corresponding RECOM DC/DC converters which are included with the board. In addition to being able to quickly evaluate the performance of the application, the complete design files are open-sourced for ease of implementation into the final design. The design can be used with voltages up to 1kV and up to 10A of current and because the signal ground is galvanically isolated from the power ground, any potential up to 2.5kV may be referenced. The board can be configured to several different topologies which can be found in the datasheet.


Tektronix, Inc.

Half Bridge and Gate Driver Measurements

Wilson Lee

The faster switching transitions on modern power devices has made measuring and characterizing a considerable challenge, and in some cases, impossible.  IsoVu technology from Tektronix allows designers to accurately measure half bridge and gate driver waveforms that were previously hidden.  During our presentation, we will we discuss the following topics: measurement challenges on gate drivers and half bridges, common sources of measurement error, why a probe’s poor common mode rejection can cause misleading and useless measurements and how IsoVu technology has created opportunities in CMTI, ESD testing, and the double pulse test.


NAMICS Technologies, Inc.

NAMICS New Technology and Products

Ken Araujo

NAMICS is developing the latest cutting edge materials for power modules packages for Die Attach, Insulating Adhesive Film and Liquid Type Encapsulation.  In this presentation, we will introduce our development approach for each material. Our Die Attach materials are characterized by a pressureless, low temperature sintering structure providing high thermal and electrical conductivity.  They offer outstanding reliability by controlling the modules to handle a variety of power module packages.  Future development is focused on a copper sintering type. ,The Insulating Adhesive Film is designed to offer low thermal resistance with thin thickness for high thermal conductivity and voltage breakdown for wide band gap applications.  Our current material offers 3 W/mK of thermal conductivity and over 4 kV/mm of breakdown voltage at 50 um thickness.  Future development is focused higher thermal conductivity over 10 W/mK. Latest demands for Power Module Packaging require materials to withstand operating temperatures over 200 degree C.  To meet these requirements, we are developing a Liquid Encapsulation Compound with a stable resin system at elevated temperature.  Our focus is on a new resin system offering high thermal stability while controlling modulus and C.T.E. to meet the rigorous reliability requirements.


Teledyne LeCroy

Debug and Validate Control, Drive and Motor Performance with a Motor Drive Analyzer

Ken Johnson 

Optimization of control systems and drive performance requires calculation of power activity during very short time periods that correspond to the power semiconductor device switching period.  The Teledyne LeCroy Motor Drive Analyzer (MDA) provides such power analysis with correlation of power activities to typical control system signals.  This session will showcase testing done using the MDA for variable flux electric machine analysis, volt-second sensing control analysis in a Deadbeat-Direct Torque and Flux (Motor) Control (DB-DTFC) and comparison of dynamic losses for various DTFC and Vector field-oriented controlled (FOC) surface and interior permanent magnet motors (SPM and IPM).


TT Electronics

Resistor Selection for Proper Circuit Operation and Reliability

Tom Morris

This presentation has a goal of educating and informing about the myriad of various resistor types such as wirewound, metal film, carbon film, carbon composition, thick film, networks, etc., their characteristics, and how to properly select them for best performance and optimum cost. Resistors have a myriad of functions in an electronic circuit and the proper resistor selection can be critical not only for normal operating parameters, but also to perform satisfactorily in certain abnormal conditions which could occur.


Wurth Electronics

How to use this stuff called ferrite

George Slama

Ferrite cores are used extensively in switching power supplies. With so many manufacturers and a multitude of materials, shapes and sizes to choose from how does the new or practicing engineer select the right core material for a given application? What does the data sheet reveal? How does one compare one core materials to another? This session will be a quick overview of what all those tables and charts in core catalogs mean from a user’s perspective.


PowerELab Ltd.

Optimize Power Supply Design in Minutes for Free – PowerEsim

Dr. Franki Poon

PowerEsim,,  is a free tool that seamlessly integrated circuit simulator, transformer/inductor building & simulation tool, thermal simulation, DVT, MTBF, Monte Carlo, Input harmonic and EMI, loop analysis in s and z domain, etc. As a whole it give engineer an virtual environment to build a power supply but do thousands times faster than in real life. Engineer can now wind a real transformer in that virtual environment and immediately see result when they change number of turn of winding method. All result immediately updated when a component changed. No even need to click a “run” button. 


HBM Test and Measurement

Rapid Efficiency Motor Mapping and Analysis

Mike Hoyer

Characterizing electric motors has become an important topic in many engineering labs throughout the world. To test and characterize electric motors, many labs have put together systems with multiple pieces of measurement equipment from different suppliers. While these systems may work, they often have high levels of complexity, synchronization issues, limited capability and operate much slower than an optimized system. This presentation will introduce a revolutionary advanced power analyzer specifically designed for dynamic electric motor testing that generates efficiency motor maps in minutes not hours, calculates any desired analysis in real-time including dq0 and Space Vector Transformation and records over 50 phases of power measurements plus multiple torque, speed, temperature, strain and vibration signals all in a single mainframe.  Producing rapid results significantly boosts productivity and R&D, saving significant time and money enabling one to design, test and produce the most efficient electric motors, better and faster than anyone else.


March 7, 2018 | 11:15 - 11:45

Pacific Sowa Corp C/O Epson Atmix Corp

High U super low core loss Nanocystalline powder "KUAMET NC1"

Yoshizawa Masahito

Epson Atmix KUAMET® series is high performing amorphous powder. NC1 is nanocrystalline powder. The u increases by 10% and core loss decreases by 25% 9A4 is amorphous powder with 15% higher saturation properties. They contribute to longer battery life, prevention of a fever and downsizing in devices. *Compared to our conventional amorphous powder.


pSemi (formerly Peregrine Semiconductor)

Vertical Integration to Support Next-Generation Power Conversion Solutions

Stephen Allen

pSemi, a Murata company, is bringing together a wide range of technologies which collectively will enable significant improvements in performance, size and cost for next-generation DC-DC converters. This presentation will describe the benefits of vertical integration – combining architectural and process innovations, together with advanced packaging and passive components to enable solutions that drive higher switching frequencies, higher conversion efficiencies, and much smaller form factors – often mutually exclusive goals.  Examples will be given from existing and soon to be released products from pSemi, solving real-life problems in power conversion for mobile, computing, datacoms and telecoms applications. 


Schunk Carbon Technology GmbH 

Graphite-Based Solutions for (Power) Electronics Cooling

Dr. Sandra Reisinger

Schunk Carbon Technology provides two graphite-based solutions for the electronics cooling industry. The composite, Aluminium Graphite, combines a high thermal conductivity with a low coefficient of thermal expansion and density, to create the ideal thermal management material for high-reliability RF, power and microelectronics applications. Schunk produces a wide range of customized parts with different plating options in various quantities. Our innovative phase change composite, Latent Heat Carbon, allows for effective buffering of temperature peaks as well as energy storage. Its unique production process allows for custom designs at attractive cost with optimal thermal properties tailored to each customer’s specific needs.



Advancements in PWM efficiency power testing

Robert Emerson

In applications where power conversion takes place and high-speed switching is involved, such as drives and inverters, great care must be taken when measuring power efficiency.  A proper measuring system for efficiency must include high frequency response for the switching consumption and also accurately measure the usable power at the fundamental frequency, and do this without error from alias.  Come join us and see this solution and the other advances ZES ZIMMER is making in single and multi-phase power analysis. 



Rapid control prototyping for power electronic systems using the PLECS toolchain

Vitalik Ablaev

Plexim creates design tools for the development and testing of power electronic systems. The company's electrical engineering software, PLECS, is widely adopted in industry and academia worldwide. PLECS is a complete power conversion system simulation package that yields robust and fast results. Plexim recently added a real-time simulation platform offering to its portfolio. The RT Box is the most versatile and easy-to-use real-time power electronics simulator on the market. With its combination of low round-trip latency, numerical accuracy, scalability, and seamless integration with PLECS, the RT Box is a versatile processing unit for both real-time hardware-in-the-loop (HIL) testing and rapid control prototyping (RCP). In this presentation, Plexim’s engineers will demonstrate RCP with an RT Box used as a controller exchanging signals with a TI Boosterpack board to spin a small DC motor. See our effortless, transparent workflow of generating real-time code from a PLECS model, deploying it onto the RT Box with one click, and viewing the real-time waveforms with the PLECS scope.



Applications and Benefits of Supercapacitor Technology

Jason Lee

Imagine the possibilities of a long life, maintenance-free energy storage! Join Jason Lee, product manager at Eaton, for a presentation on the benefits and features of supercapacitors, and how they can be utilized in transportation, industrial, energy, medical and computing markets. Learn about key supercapacitor products and differentiators, and hear how supercapacitors can replace or extend the life of batteries in transportation, renewables, grid storage and UPSs.


Sidelinesoft LLC

NL5 - Circuit Simulator With Ideal Components

Alexei Smirnov

Most electronic circuit simulation tools on the market are based on the SPICE algorithm. It provides high accuracy and fast simulation, with many models of real components available from manufacturers. However, there are many tasks and applications, especially in power electronics, where SPICE does not perform well, and sometimes does not work at all. NL5 Circuit Simulator is proven to be a perfect alternative to SPICE for such tasks. Instead of very complex models of semiconductor devices, it deals with very simple “ideal” components. As a result, simulation is extremely fast and reliable, with practically no convergence problem. Great performance, ease of use, and many unique features developed in more than 25 years, made NL5 a tool of preference for many users all over the world.


Efficient Power Conversion Corporation

GaN Transistors for Efficient Power Conversion

Alex Lidow, Ph.D.

In a post-silicon world, GaN is taking power conversion to the next level. Gallium nitride transistors are rapidly being designed into many power conversion applications. This seminar will provide an update on the state-of-the art in GaN transistor technology, highlighting the latest generation of EPC enhancement-mode GaN products and end-use applications including high power density DC-DC converters, high frequency envelope tracking, LiDAR, and wireless power transfer.


Wednesday, March 7, 2018 | 12:00 - 12:30

Iwatsu Electric Company Limited

Comparison between Digitizer, Power Analyzer and CROSS POWER method on magnetic material analysis

Ryu Nagahama

Iwatsu introduces two types of solutions for low power loss devices test measuring core losses following the CROSS-POWER method, power analyzer, and digitizer method. The CROSS-POWER method enable precise and highly accurate measurement embedded minimizing phase error integration in current detector (current probe) and compensating in detection circuit on amplitude and phase.


STAr Technologies, Inc.

Taurus PDAT - Power Device Analytical Tester

Mr. Dan Hicks

Today’s GaN and SiC power devices and their ever-increasing slew rates present challenges for manufacturers and end users who want to accurately measure and characterize these devices’ AC dynamic performance.  STAr Technologies offers a new, innovative test solution to solve this problem with the Power Device Analytical Tester (PDAT).  AC performance parameters such as diode recovery, switching energy loss, and rise/fall time can now be accurately and easily measured on GaN, SiC, IGBT, and MOSFET transistors and diodes.  Join us for a discussion to see how PDAT makes this possible and how it can benefit you.


West Coast Magnetics

What does the future hold for transformers and inductors in medium and high power applications

Weyman Lundquist

Passive magnetic components that store and transfer energy are typically amongst the largest items in an electronic assembly.   There is substantial room for size and cost reduction over the next 5 to 10 years.   This talk will examine how far these improvements can be taken. Improvements in magnetic components can be achieved from a number of areas including specialized core materials, winding design, more efficient packaging.    This presentation will first focus on improvements that are available through improved packaging and the future for lower loss core materials. Next, parameters that influence winding loss will be presented, for example, different winding techniques and the relative advantages of different types of windings including the patented shaped foil technology developed by WCM and the Thayer School of Engineering at Dartmouth. Finally, the effect of switching frequency on the size of magnetic components and the improvements available today and in the future from going to increased switching frequencies will be presented.


Danfoss Silicon Power GmbH

Automotive traction module platform

Siegbert Haumann 

Based on several years of experience, Danfoss has developed a new, scalable power module platform that lives up to stringent automotive requirements.  The module family combines Danfoss’ unique technologies; the high performance direct liquid cooling system (ShowerPower® 3D), advanced sintering die attach and copper-wire-bonding (Danfoss Bond Buffer™) all in utilizing the robust encapsulation method of transfer molding. The platform will allow for flexible use of Si and SiC power semiconductors and will be designed to meet the customers’ specific mission profiles. The design will be able to adapt to both 700V and 1200V Si and SiC devices and with battery voltages of 400V or 800V. 


ITG Electronics Inc.

COTS Filters for MIL-STD-461 Applications

Rafik Stepanian

How to mitigate and select a Commercial Off the Shelf (COTS) EMI filter for MIL-STD-461 applications. EMI requirements are often ignored during product and system design. This is because there are typically no set parameters to design an EMI solution during the product design cycle. Design engineers today are tasked to provide low cost COTS EMI filter solutions for military applications to mitigate unwanted EMI emissions. This presentation identifies EMI noise generators, provides EMI test methods, their limits, the failure modes and finally how to choose proper EMI filter solutions that meets the MIL-STD-461conducted emissions from 10KHz to 10MHz requirements, and maintain filter attenuation up to 1GHZ and above when installed in the system with additional shielding and isolation between input and output terminations.


United Silicon Carbide Inc.

USCi Gen 3 Cascode and Diode products

Anup Bhalla

SiC devices from USCi have been assessed in Totem-Pole PFC and Vehicle On-board charger applications. Demo boards provided by USCi are discussed in this session, to aid evaluation of the USCi devices. The standard gate drive, excellent switching and Qrr characteristics are shown to result in excellent efficiency performance with ease-of-use. Attendees will get a clear understanding of the device characteristics and how they drive performance in these and similar power conversion applications.



ULTEM UTF120 High Temperature Dielectric Film For Capacitor Applications

Dr. Neal Pfeiffenberger

A new class of high temperature capacitor films, based on polyetherimide (PEI) chemistry, has been developed and electrically characterized versus other common dielectric capacitor films. From fiber optics to high temperature flame resistant personal protection equipment (PPE), ULTEMTM resin has long been used in applications which demand long-term high temperature resistance and dimensional stability.  SABIC’s ULTEM UTF120 film has been developed to offer excellent handling and processing through common metallization and capacitor winding equipment for both round and squashed capacitors. Additionally, ULTEM UTF120 film can provide stable electrical performance through temperature and frequency, making it an outstanding candidate for DC applications such as electric compressors and DC-DC converters. SABIC is a global leader in diversified chemicals with manufacturing and R&D facilities in the Americas, Europe, Middle East and Asia Pacific. We support our customers by collaborating and developing solutions in key end markets such as electrical and electronics, construction, medical devices, packaging, agri-nutrients, transportation and clean energy. 


Mitsubushi Electric US, Inc.

Latest Power Semiconductor Packaging and Chip Technology

Eric Motto

This session will highlight the latest power semiconductor modules from Mitsubishi Electric, featuring state of the art silicon and silicon carbide chip technology along with new high reliability packaging, to provide increased efficiency and higher performance for industrial, automotive, and alternative energy applications.