|Session #1||Session #2||Session #3||Session #4||Session #5||Session #6|
New Power Inductors for High Frequency DC-DC Converters
|Aavid Thermalloy LLC
Aavid Thermalloy Expands Capabilities & Products with Niagara Acquisition
Robert Soucy, Mark Parisi
An Industry First – Silicon Carbide based Intelligent Power Module
1200V Smart Power Module for Low-Power Industrial Motor Drive Applications
|Adaptive Power Systems
Advanced Power Conversion Test Equipment
Herman van Eijkelenburg
|(PANEL) Eaton, Power Systems Design, Vicor, GaN Systems
Next Generation of Power Supplies
Zhuo Min “Joe” Liu (Eaton)
Alex Paultre (Power Systems Design)
Larry Spaziani (GaN Systems)
Paul Yeaman (Vicor)
|101B||Dino-Lite Scopes (BigC)
Dino-Lite Digital Microscope: Edge Series
The Practical Side of Faster, Smaller, More Efficient Power Converters
|Fair-Rite Products Corp.
Low loss 67 Material for High Frequency Power Applications
Digital Power Design Featuring Intersil’s ChargeMode and Hybrid Digital Controllers
Brandon Howell and Chance Dunlap
|Efficient Power Conversion Corporation (EPC)
GaN…Changing the Way We Live
Dr. Alex Lidow
|ABC Trading Beijing Co. LTD.
BsT-x measuring system for soft magnetic materials under high excitation
Mr. JC Sun
|102AB||Hydro-Québec Research Institute (IREQ)
Simulating Power Electronics Converters Using MATLAB/SimPowerSystems. The Right Balance between Performance and Fidelity
Pierre Giroux et Patrice Brunelle, Research Scientists
Large XFLUX® and Block Structures for High Current Applications
Brad Van Fleet
Fast computation of Inductance, Capacitance, Current Density in conductor arrangements
|KEMET Electronics Corporation
Capacitor Modeling and Simulation
Wilmer Companioni, Technical Marketing Engineer
Safety and Reliability for Power Electronics
|Amantys Power Electronics Ltd
Intelligent Gate Drives – Delivering the Silicon Squeeze
MOSFET Driver IC Solutions from Infineon Technologies
|NH Research, Inc.
Testing Vehicle Power & V2G Applications
|Monolithic Power Systems (MPS)
High Performance PMSM Servo System Using MPS e.Motion Technology
Ted Smith, Sr. Field Applications Engineer
|Schunk Hoffmann Carbon Technology
Aluminium Graphite: The Optimal Thermal Management Solution for High Reliability Applications
Dr. Sandra Reisinger
|Microchip Technology Inc.
Brutes and Brains: When Adding Intelligence to Power Supplies Makes Sense
Janmichael Aberouette and Fionn Sheerin
|Analog Devices Inc
Ultra Low Noise LDOs Maximize Signal Chain Performance
New ASIC based Open Loop Transducers
New DIPIPM™s Featuring More Integration and Lower Cost
Michael Rogers, Powerex Applications Engineer
Energy Efficient Innovations
Accurate Modeling and Simulation of Contemporary Power Converters using Saber
|Pacific Sowa Corp C/O Epson Atmix Corp
Atmix’s High Performing Magnetic Powder for Inductors
Software Defined Power®
|201B||NXP Semiconductors USA, Inc.
Introducing new Motor Drivers featuring Functional Safety and Higher Torque
Designing Digitally Controlled Systems with SIMPLIS
|Typhoon HIL, Inc.
Ultra-high Fidelity Hardware-in-the-loop Simulation for Power Electronics and Microgrid
Alex Sedaghat, Applications Engineer, Typhoon HIL, Inc.
Improved Efficiency in LED Lighting Control
|Renesas Electronics America Inc.
Lithium Ion Battery Charging and Fuel Gauging for better functionality
Peter H. Wilson
|Hitachi Power Semiconductor Device, Ltd.
New Packaging Generation.
The next standard for High Voltage (1.2kV-6.5kV) IGBTs
Silicon Carbide MOSFET Benefits in Automotive Applications
Performance Components for Power Applications
|ZES ZIMMER Inc.
New AC power measuring advancements: Power Supplies, Drives, PWM, Harmonics, Waveforms and more
High Performance Integrated DC Link Capacitor/Bus Structures and AC Filter Capacitors
Dr. Michael Brubaker, VP Engineering and CTO
|Software Cradle Co., Ltd.
Cooling Fan Design System with Automated Performance Prediction
Big Batteries: take a walk on the
high side with TI’s 100-V FET driver
Allen Y Chen
Product Marketing & Applications
Battery Management Solutions –
Monitoring & Protection
The Ultimate Electric Vehicle Powertrain Solution
Dr. David Levett, Infineon Technologies Industrial Power and Control Division
Matthew Reynolds, EPCOS, Inc. A TDK Group Company
|“Würth Elektronik eiSos
8 Simple Design Tips – How to Design in a Power Inductor
|Wurth Electronics Midcom
Custom Flyback Transformers Made Easy
This presentation introduces new power inductors optimized for 2 to 10 MHz switching. As switching frequencies increase in order to reduce the size of passive components, new magnetic designs are required to fulfill that promise. This presentation will describe new inductors and the data users need from inductor suppliers to incorporate them in optimized designs for best efficiency and small size.
Dino-Lite handheld USB microscopes used for inspection and quality control. Most models provide 10x-200x magnification, with higher magnification ranges going up to 500x and 900x. The included DinoCapture software includes capability to capture images, record videos annotate and perform measurements, and save and email discoveries. The Edge series contain an enhanced sensor for improved image quality. New features include Extended Depth of Field (EDOF), Extended Dynamic Range (EDR), and Automatic Magnification Reading (AMR). 5MP resolution Edge series units also have Flexible LED Control (FLC) to enable partial illumination. Mobile solutions include use with our wifi adapter or a direct connection to Windows RT tablets or select Android devices.
Hydro-Québec Research Institute (IREQ)
Simulating Power Electronics Converters Using MATLAB/SimPowerSystems. The Right Balance between Performance and Fidelity
Pierre Giroux et Patrice Brunelle, Research Scientists
When power system engineers are simulating power electronics converter-based systems using advanced simulation tools, they are often required to use special modeling techniques in order to speed-up simulation. However, these techniques may have drawbacks that will impair simulation results, hence the need to find the right balance between performance and fidelity.
The tutorial presents four different levels of abstraction for modeling power electronics converters. These levels are described, along with simulation results. A comparison of the methods and a description of their respective domains of validity are also presented. Last, the most appropriate method for a given phenomenon under study is proposed.
Driver ICs are used for high power SMPS to create a crucial link between control ICs and switching MOSFETS which require higher gate drive voltage and current. Use of Driver IC offers ease of design, leads to higher power density and increases reliability and robustness of the solution. This session focuses on important features and requirements for driver IC and also highlights driver IC solutions from Infineon. The audience will benefit from this session by understanding the criteria for selecting the right driver IC solution for their application.
How LEM’s new ASIC design greatly improves Open Loop Transducer performance and flexibility.
Introducing a new motor driver product family designed for automotive engine control applications. The MC33HB2000 and MC33HB2001 product family providing many firsts in the industry.
It will be the first motor driver fully certified to ISO26262 to support ASIL level D system qualification. It features a patented thermal management scheme ensuring high efficient operation by reducing switching losses when motor is experiencing heavy loads or binding. It provides the lowest integrated RDS (ON) as well as the most accurate current feedback circuit providing continuous motor operation in critical applications and harsh environments.
The product will be featured in the NXP booth with a hands-on demonstration using the MC33HB2001 brushed dc motor driver. We will apply loads to these devices driving them into their over current condition and using a scope to monitor the devices thermal management functions.
In Automotive applications large advantages are offered by Silicon Carbide (SiC) solutions at any load condition in terms of power losses, efficiency and consequently longer battery autonomy as well as smaller cooling system. However SiC MOSFET solution must be dimensioned in order to maintain a reasonable junction temperature at the peak power condition where any MOSFET solution is affected by huge conduction losses that can be only partially counter-compensated by the much better switching performance.
Big Batteries: take a walk on the high side with TI’s 100-V FET driver
Allen Y Chen
Product Marketing & Applications Manager
Battery Management Solutions – Monitoring & Protection
Texas Instruments Big Batteries: take a walk on the high side with TI’s 100-V FET driver 203AB Drones, cordless robotics, energy storage systems and light electric vehicles all share one key thing in common: they rely on big batteries, and consumers expect a premium product to match the premium price tag. TI’s new bq76200 is the first-ever high-side battery FET driver for such high-voltage battery applications, offering incredible flexibility to battery pack designers looking for robust, low power protection FET control. The bq76200 eliminates the struggles associated with building complicated, reliability-constrained discrete charge-pump circuits to achieve a high-side FET drive, and is a perfect complement to many of TI’s existing battery monitors and companion fuel gauges. It helps designers promise the best of all worlds: a truly intelligent battery, capable of collaborating with a system 24/7 while maintaining protection and ensuring longevity.
With the acquisition of Niagara Thermal Products, Aavid continues to expand and round out its capabilities and products to serve multiple industries, and markets with the latest in technology, manufacturing and complete Global Supply Chain management. This discussion will outline the advantage of working with Aavid – Niagara on any Electronic Cooling Application, with complete Global manufacturing and technology centers located around the world. With the added specialization in process, engineering, and manufacturing, the Aavid-Niagara offers the market a complete supplier that really is the leader in all aspects of Electronic Cooling, from complete systems to simple components.
Faster, better power switches are essential for building faster, better power converters, but they are not a solution by themselves. Parasitics and latency must be minimized, and controls, magnetics and filters must be reexamined.
CogniPower is demonstrating a fast Predictive Energy Balancing power converter that takes good advantage of an advanced GaN output stage. What are the challenges involved?
In this presentation, we will go over new offerings from Magnetics geared for use in high current inductors and chokes. This includes discussion about the expansion of our XFLUX product line as well as new capabilities related to the creation of custom block structures. An overview of a few inductor designs with these new products will be presented to showcase the advantages of each and to provide guidance on applications where they will be useful. In addition, topics related to inductance calculations and testing for block structures will be reviewed.
This session describes the key factors in selecting the right equipment used for testing vehicle power systems as well as vehicle-to-grid (V2G) applications. Selecting the right equipment simplifies testing allowing for earlier validation, faster time to results, increased test coverage, improved design characterization, and enables research for emerging applications such as vehicle-to-grid (V2G). Use these key factors in selecting test equipment as using the right tool for the job always simplifies the effort required.
Powerex is pleased to introduce the latest Dual In-line Package Intelligent Power Modules (DIPIPMs™) designed to meet demands for low cost, high reliability, more integration and space savings in small industrial and commercial motor drive applications. This presentation will feature two new products:
(1) The new slim package SLIMDIP series power module, developed primarily for white goods applications such as air conditioning, refrigeration and washing machines, utilizing RC-IGBT (Reverse Conducting IGBT) technology which integrates the IGBT and free-wheel diode into a single super thin chip to provide considerable space savings and lower cost.
(2) The new all-in-one transfer molded DIPIPM+, developed primarily for small industrial motor drives, includes CIB (Converter-Inverter-Brake) circuits and built-in gate drivers with protection functions. The result is a significant total system size and cost reduction.
DIPIPM is a registered trademark of Mitsubishi Electric
A design methodology is presented for designing digitally controlled systems using the SystemDesigner features of the SIMPLIS simulator. Taking full advantage of these SystemDesigner capabilities, we demonstrate how users can simulate their digitally controlled systems such that they have the option, with a single schematic, to model the signal path as either signed integers or double precision floating-point numbers. Modeling the signal path with double precision allows users to take advantage of the SIMPLIS Periodic Operating Point and AC analyses. Modeling the signal path as signed integers captures the expected quantization effects of the digitally controlled loop.
This technique is applicable for both hardware and firmware/software digital control implementations. Using an LLC DC-DC converter as an example, we show how to transition from an analog controller to a digital control implementation.
As the share of Electric and Hybrid Vehicles of the overall passenger vehicles production increases, requirements for the propulsion drives and filters becomes ever more complex. The drives must become more compact, resistant to mechanical shock and vibration, and operate over longer lifetimes, both more reliably and more efficiently. Additionally, specialized filters are required for the reduction of electromagnetic noise, voltage spikes and ground currents in order to further extend the life of the electric motor, to reduce interference with communication systems within the vehicle and to eliminate the necessity of expansive shielded high voltage cables. Join us as we further discuss the solutions Infineon and EPCOS have developed to address the challenges faced in the ever growing market of electric and hybrid vehicles.
Vishay will highlight its latest industry-leading power MOSFET, passive component, and diode technologies for a wide range of power applications.
Since inception, AgileSwitch has introduced products true to its mission “Digitize a traditionally Analog Power Electronics World” and with the introduction of the Industry’s First SiC IPM, we take this a step further.
Come Take a peek at how AgileSwitch’s technology can enable a quick turn implementation of next generation SiC technology at a fraction of the cost of a standard development cycle.
The development of high frequency switching power converters has driven the need for low loss magnetic materials.
Due to the lack of material performance data, the design of power magnetic components for high frequency operation (2-20 MHz) has been difficult to achieve.
This presentation will review the intrinsic material characteristics (such as power loss density & useable flux density) in low permeability Ni Zn ferrites and will focus on Fair-Rite type 67 Material.
In power converters, the electromagnetic behavior of “metallic cabling” which interconnects semiconductor components is non-ideal : parasitic resistive, inductive and capacitive effects occur in such power devices causing respectively energy losses, switching overvoltages and EMC issues. In particular, interconnection parts (i.e. electrical conductors) generate electromagnetic stress and possibly system failures, since they add to the expected fonctional behavior of the converters.
This presentation will highlight the importance of 3D electromagnetic simulations which help designers in assessing these undesirable effects and improving system performances: InCa3D is a simulation software for low & medium frequencies dedicated to electrical interconnection modeling. Based on the innovative and very efficient PEEC (Partial Element Equivalent Circuit) method, it is well suited for analyzing the behavior (current distributions, radiated magnetic fields) of almost any kind of connections, additionally providing RLC extraction and generation of equivalent circuits.
Benefits of its use during the design of power devices will be illustrated by examples.
The booming robotic industry is calling for high-performance servo systems. This presentation introduces a high-performance PMSM servo system using MPS proprietary eMotion technology, which combines an accurate magnetic position sensor, a 3-phase PMSM motor driver, and an FOC control algorithm. This presentation will discuss MPS’ magnetic sensor technology, the benefits of FOC control, and the GUI software.
ON Semiconductor will present the latest developments in power semiconductors and high density power applications. This will include new high efficiency products and design considerations.
Significant and growing penetration of smart inverters represents both challenges and incipient opportunities to increase utility grid agility and stability. In addition to inherently fast dynamic control capabilities, these power electronics systems interact with increasingly diverse physical systems (such as renewable generation technologies) in complex ways. Indeed, grid is becoming a true cyberphysical system with a layered architecture comprising both power processing and control and communications. Classical tools that are used for simulation, testing, and system validation are very limited in both model fidelity and flexibility. In this talk we will present a new approach to power electronics and power system controls testing and validation based on ultra-high fidelity Hardware-in-the-Loop (HIL) real-time simulation.
Our HIL platform enables ultra-high-fidelity real-time simulation of power electronics converters, microgrids, distribution and transmission networks, with 1μs simulation time step. In addition, our HIL simulation is directly interfaced with real digital controllers, thereby eliminating modeling assumptions and thus providing the most realistic “flight simulator” experiences for power electronics and power system simulations. We will discuss how Typhoon HIL is changing the testing and quality assurance processes in power electronics industry today and how we are helping, in our small way, utilities and system integrators revolutionize the grid.
This practical session is developed to help you with your applications and designs to gain a better understanding, and make your daily work easier, when choosing the correct power inductor for your switch mode power supply. You’ll be able to differentiate between a low loss and a low cost magnetic component at the end of the session.
ZES ZIMMER, the German company dedicated to precise power measurement, recently has introduced it’s 4th generation power analysis platform with major improvements for measuring high speed switching circuits: analyze high frequencies accurately while also conforming to Nyquist constraints for waveform transformations without alias. Special DualPath technology offers revolutionary A-D improvements and advanced filtering to recast the power analysis landscape. Cut engineering time in half, reduce cost and time to approval, while maintaining the world-class accuracy for which ZES ZIMMER has been known for more than 30 years. Come see advancements also in waveform processing and streaming, UI, versatility process control, QA and more.
1200V Smart Power Module for Low-Power Industrial Motor Drive Applications
As environmental issues continue to be a worldwide concern, energy saving opportunities become more essential in system development. The adoption of low-cost inverter drive technology in motor drive applications can help. To address these demands in low-power industrial applications, the 1200V SPM® smart power module has been developed. This paper will present in detail the design issues, performance investigation, and other important considerations about the new 1200V SPM 3 module family.
The 1200V SPM® 3 series of intelligent, integrated IGBT inverter modules are optimized for low-power industrial motor drive applications. The technology utilizes non-punch-through trench IGBTs with advanced STEALTHTM free-wheeling diodes, high-voltage ICs, and multi-function low-voltage IC. It also provides technical advantages such as improved thermal performance and reliability characteristics through the DBC substrate, as well as temperature monitoring with the TSU (temperature sensing unit) function of the LVIC.
In this session, we’ll explore Intersil’s latest full digital ChargeMode™ controllers, along with a new family of hybrid digital controllers featuring Intersil’s proprietary R4™ control loop. Both controller families include a PMBus™ interface, which when coupled with Intersil’s PowerNavigator™ software design tool, provide a paradigm shift in ease of use for power supply design. Where traditional analog controllers have typically taken days to fully implement, Intersil’s new family of controllers utilize built-in intelligence, advanced control loops and PMBus flexibility to dramatically shrink design times. In this session, we’ll introduce Intersil’s latest digital POL controllers and demonstrate design examples using PowerNavigator.
Methods and techniques for simulating capacitor behavior
Schunk Hoffmann is a world leader in the automotive and rail sectors. By modifying our existing product portfolio, we have developed a set of metal matrix composites called Aluminium Graphite (ALG). They combine a low coefficient of thermal expansion (CTE) with a high thermal conductivity, making them ideal candidates for systems that are subject to active or passive thermal cycles. The use of ALG leads to a marked improvement in the reliability and life-time of components and systems. This presentation will point out the unique properties and characteristics of ALG, its fabrication process, and possible applications. These include heat sinks or heat spreaders, such as flanges for RF power amplifiers, base plates for power modules and housings. Schunk Hoffmann can deliver customized designs and platings as the fabrication and machining of all parts is conducted in-house.
Saber is a multi-domain system modeling and simulation platform that meets the challenges of contemporary power electronics verification. Saber combines robust mixed signal simulation with advanced modeling capabilities including power semiconductor and magnetic tools, state-flow and logic for control, and HDL and table look-up methods for efficient behavioral modeling. New Saber fault modeling and simulation enables functional safety and reliability verification of power electronics systems. Optimization-based algorithms identify the design parameters leading to optimal or worst-case performances, such as power efficiency. This presentation will showcase these features on a commercially available quasi-resonant flyback power converter.
Saber is particularly advantageous to model the control of power converters. The key features of the IC controller modeled in this flyback example are the frequency foldback and the input voltage feedforward function. A SPICE approach would not be able to easily model the blanking time of the frequency foldback function, which is a nonlinear curve conveniently created with the Saber Table Look Up modeling tool. Similarly, the MAST and VHDL-AMS hardware description languages offer a straightforward way to implement the expression for voltage feedforward without rigging up a subcircuit required by many other simulators.
AC/DC LED lighting control and product design face many challenges as global markets and government regulations drive requirements for efficiency, reliability, EMI performance, and cost reduction. In this session, Taiwan Semiconductor will present efficient solutions for LED power supply regulation, power factor control, LED dimming, and LED load protection. Various high efficiency, low noise constant current and constant voltage switch mode power supply topologies and supporting component technologies will be presented.
Have you ever struggled to find a transformer for your flyback power supply design? Has the transformer threatened to delay or even kill your project? Attend this session to find out how easy it can be to find a custom solution for your design with samples available in stock. The STS (Smart Transformer Selector) makes finding a custom flyback transformer for your specific design as easy and efficient. In basic mode, you can find suitable parts in seconds. If you wish to be more specificc you can use the expert mode to define more detailed parameters.
This session provides an overview of available solid state AC power sources for development and test applications. Highlights what to look for in product specifications and how to properly size the AC source for your requirements.
GaN is taking power conversion to the next performance level. Gallium nitride transistors are rapidly being designed into many power conversion. This seminar will provide an update on the state-of-the art in GaN transistor technology, highlighting the latest generation of EPC enhancement-mode GaN products and end-use applications including high power density DC-DC converters, high frequency envelope tracking, and wireless power transfer.
This session will demonstrates Mersen’s commitment to develop industry-leading technologies to improve efficiency and reliability of power electronics equipment.
The session will focus on three key topics of:
– Fast Acting Power Semi-Conductor Fuses providing most reliable fault current protection for SiC and WBG devices.
– Air and Liquid Cooling Systems and Thermal management solutions to provide thermal protection for semiconductor components while enabling heat to dissipate. Efficient cooling is key to long term reliability and performance of fast switching SiC components.
– Laminated bus bars providing most efficient connection between various components, thus limiting parasitic inductance, improving ease of assembly and
integration while minimizing wiring errors and costs. Laminated bus bars provide clear advantages in SiC applications.
Many power supplies can benefit from digital interfaces or digital controls – but the additional design challenges can be daunting. In many cases, a traditional analog control loop can be an elegant and effective solution. Microchip will describe the system tradeoffs and go through application-specific use case examples including LED drive, point-of-load power conversion, PMBus implementation, and server power. For each application the difference between digital and analog control presents different benefits and challenges. In addition, this presentation will include a short demonstration of the MPLAB® Code Configurator development tool, which uses a graphical interface to setup closed loop power supplies and automatically generate digital power control firmware.
Introduction of the soft magnetic powder produced by Epson Atmix Corporation.
This seminar will discuss extending battery life utilizing Renesas’ lithium ion battery management solution for mobile platforms. We will show improved performance for faster charging time and minimized battery degradation for longer battery life. A typical lithium ion battery management solution includes fuel gauging plus charge control. Previously, the fuel gauging and charging functions have been separate ICs. Combining the fuel gauging and charging into one IC has advantages to better managing the fundamental task of fully recharging the batteries in 1S to 3S cell applications. We will explore the enhancements to the functionality and performance for mobile applications where space is premium.
The session will begin with an overview of SBE’s unique ring capacitor technology and the advantages of this form factor in terms of losses and thermal resistance. The discussion will then shift to DC link capacitors and the use of SBE capacitor/bus technology to achieve very low inductance topologies. Some representative commercially available parts using “surface mount” capacitors will be discussed and compared to conventional technology. The remainder of the session will focus on AC filter capacitors and the unique advantages of the SBE ring form factor combined with patented pulse technology to eliminate catastrophic failure. The SBE AC filter offers novel mounting topologies and operates at lower hotspot temperatures than conventional cans. Examples of AC filter implementations using ring capacitors will be provided.
(PANEL) Eaton, Power Systems Design, Vicor, GaN Systems
Next Generation of Power Supplies
• Zhuo Min “Joe” Liu (Eaton)
• Alex Paultre (Power Systems Design)
• Larry Spaziani (GaN Systems)
• Paul Yeaman (Vicor)
Between evolving topologies, advanced materials, and improved core technologies, the way we manage and distribute power is under multiple pressures to change and evolve as well. This is especially dramatic in the area of power supplies themselves, the heart of every electronic system. These core enablers also change the devices they power, in areas such as form factor, thermal management, operational lifetime and the increased focus on higher power densities. From wide-bandgap semiconductors to advanced power supply topologies to the latest magnetics, the panelists from Vicor, Eaton, and GAN Systems have a deep understanding of these pressures. The panel will explore some of the ways to address these issues and help predict the future of the power supply.
characterisation of magnetic properites under high excitation becomes increasingly important, the differentiation under high excitation i.e. high frequency ripple current biased with quasi DC complicates structured and systematic approach to target the specific target. the available data of core vendors can not afford nowadays demand of design engineers for accurate simulation and tailor made inductive component designs.
bst offering open & transparent automatic measuring system, effectively provides desired information of different soft mangetic materials over wide range of permeability level, especially the bst-pro highlights the loss characteristics with more dimension dependency (frequency, delta B, biased field strength and temperature), this helps material iinnovator to navigate development roadmap and enables design engineer for accurate and customized inductive coomponent design
Recent advances in power converter technology have demonstrated that intelligent gate drives can deliver a “smart converter”. There is the opportunity to apply advanced gate drive techniques to the devices to further increase their utilization – a “silicon squeeze” – and with this comes the need to monitor more closely their operation, e.g. through condition monitoring. This presentation considers not only the challenges of such an approach, but also the potential economic and technical benefits and opportunities for the end user and operator.
This session introduces LDO fundamentals and important Noise/PSRR characteristics. It dives into the noise sensitivity on various signal-chain loads, and provides an understanding of how to choose right LDOs to achieve best performance for RF transceivers, Clocking ICs, PLL/VCOs and latest high-speed ADCs and DACs. A particular focus on where ultra-low noise LDOs to maximize overall RF signal-chain performance will be discussed.
Software defined power is the next evolution of power supply optimization. In general, the efforts have resided in the power supply, whether Point of Load, Bus Converter or a front end power supply. CUI will discuss the next evolution of software defined power by adopting Virtual Power Systems’ Integrated Control of Energy (ICE®) in a datacenter racking system.
CUI will review the ICE Block platform and the advantages that ICE has in realizing a 15-25% savings in power, significant capital expenditure reduction and better optimization of the power footprint in a datacenter environment.
Hitachi has introduced nHPD2 (next High Power Density Dual) as the next generation package standard for high voltage power modules. It has the benefits of low inductance, high power density and scalability, and also includes a current sensor and temperature sensor. This package not only targets the next generation of Si chip technology, but also brings significant advantages for use with SiC technology. In this seminar, we would like to introduce the state-of-the-art for Si and SiC in the nHPD2 form factor.
In addition to nHPD2, we have introduced the latest generation of 4.5kV IGBT for medium voltage drive applications, covering a wide frequency range. By using advanced trench HiGT (High conductivity IGBT), rated current was successfully increased by 25% realizing 1500A within the same footprint.
A cooling fan is widely used as a cooling device in electronics. In CFD, modeling methods of cooling fans can be categorized into two methods. One method is used to predict detailed flow by modeling the shape of the blade and the frame in detail. The other method is used to predict the flow rate as a simplified model defining the relation between the pressure and the flow rate (P-Q Curve). The former method is best suited for predicting performance of the fan itself while the latter method is suitable for an electronic system level simulation. While the latter method significantly simplifies the procedures of the electronic thermal simulation, it has still been challenging to utilize CFD for axial fans due to the complexity of modeling a fan in 3D, as well as the knowledge required to perform detailed fan simulations in CFD.
Therefore, we developed an innovative tool “”SmartBlades””, which allows a fan designer to quickly and easily design a fan in 3D and to predict its performance. SmartBlades is equipped with a sophisticated GUI which enables a user to intuitively design a blade profile by specifying parameters or dragging graph lines to define rake angles, skew angels, thickness, and other parameters of a blade. In this way, 3D geometry of a fan can be quickly and easily created even without any CAD experience. Furthermore, SmartBlades is linked to Cradle SC/Tetra CFD software and automatically performs the CFD simulation to report a fan performance curve including P-Q curve, power curve, and efficiency curve. As a result, the fan designer can quickly design an optimized axial fan to meet various criteria using SmartBlades and can significantly reduce the product lead time.