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Tuesday, February 26, 8:30 am - Noon
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Technical Session 5: Thermal, Packaging, and System Integration
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Title
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Author(s)
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Paper # |
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3D Integration of Power Supply for Non-isolated Point-of-load Applications
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A. Ball
M. Lim
F. Lee
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5.1
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System in Package with Mounted Capacitor for Reduced Parasitic Inductance in Voltage Regulators
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T. Hashimoto
T. Kawashima
T. Uno
Y. Sato
N. Matsuura
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5.2
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Heatsink-fan Cooling System Design for High-Temperature Power Modules
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P. Ning
J. Claassens
K. Ngo
F. Wang
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5.3
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Analysis and Experimental Study of On-Chip Bondwire Transformers for Power SOC Applications
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J. Lu
H. Jia
A. Arias
X. Gong
Z. Shen
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5.4
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Investigation on Current Density Limits in Power Circuit Boards
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L.Coppola
F. Wildner
D. Cottet
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5.5
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Simulation of the non-idealities in current sharing
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M.Paakkinen
D. Cottet
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5.6
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Conference at a Glance 
