top
 
 
Home | Contact Us | Site Map
 
 The Applied Power Electronics Conference and Exposition


APEC Sponsors 
PSMA logoIEEE logo
pels logoIAS logo

 
Home arrow Special Presentations
 
PDF Print E-mail

Tuesday, February 26
      8:30 am – 12:00 Noon

SP1: Market Trends

Session Chair: Ada Cheng, International Rectifier

SP1.1: Power ICs Market Growth – Good News for All?
A. Sharma, IMS Research

SP1.2: Evolution of Power Supply in a Package to Power Supply on a Chip
B. Narveson, Texas instruments, PSMA Packaging Chair and C. O’Mathuna, Tyndall National Institute, PSMA Packaging Committee Chair

SP1.3: More Power to You with Digital Power
M. Vukicevic, iSuppli

SP1.4: The Impact Energy Conservation Awareness on Industrial Motor Drive Growth
S. Odom, IMS Research

SP1.5: Are GaN & SiC Ready for Prime Time?
T. Hausken, Strategies Unlimited

SP1.6: Lighting Technologies Panel Discussion
J. Gamble, Datapoint Research

 

Wednesday, February 27
      8:30 am – 10:15 am

SP2: Business

Session Chair: Carol Williams, Trendsetter Electronics

SP2.1: When the Price of Everything Drops: Who benefits from declining semiconductor price?
S. Ohr, Gartner Dataquest

SP2.2: Key Procurement Best Practices
D. Hawtof, iSuppli

SP2.3: A Perspective on How Wall Street Values Power Electronics
S. Smigie, Raymond James & Associates, Inc.

SP2.4: The Future of Power Supplies
M. Mankikar, Micro-Tech Consultants

 

Wednesday, February 27
     2:00 pm – 5:30 pm

SP3: System Design

Session Chair: David Carey, Portelligent Inc.

SP3.1: Understanding the Power Needs for ATCA Systems
F. Cirolia, Emerson Nuclear Power

SP3.2: Power Connectors Evolve to Support Next Generation Equipment
B. Hult, Bishop & Associates, Inc.

SP3.3: IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries: What It Means
P. Parker, Lineage Power; S. Strand, IBM, IPC-9592 Subcommittee Chair; and N. Witkowski, Alcatel/Lucent, IPC-9592 Subcommittee Vice Chair

SP3.4: PMBus Application Profiles Developed to Address the Need for Commonality in Improving Power Monitoring and Management
G. Richards, Dell

SP3.5: Thermal Design and System Performance Tradeoffs
C. Biber, Biber Thermal Design, Ltd.

SP3.6: Avoiding Five Common Mistakes in High Frequency Power Magnetics Design
D. Monroe, Torotel Products Inc.

SP3.7: Optimizing High Current Voltage Regulator Design for the Data Center
G. Schuellein, International Rectifier

Thursday, February 28
     8:30 am – 11:30 am

SP4: Power Electronics for a Greener World

Session Chair: Baskar Vairamohan, EPRI

SP4.1: Server Power Delivery and Control for Data Center Efficiency
K. Boyden, International Rectifier

SP4.2:  Energy Efficiency Through Power Electronics
J. Rudiak, Infineon Technologies

SP4.3: Compressed Air and Thermal Energy Storage for UPS Applications
K. Schuetze, Active Power
 

SP4.4: On the "Renewability" of Energy
D. Patterson, University of Nebraska 

SP4.5:  Server Administered Client Power Management
J. Taylor, Dell

SP4.6:  A GPS for the Energy Efficiency Regulation Highway
C. Mullett, On Semiconductor

 

Thursday, February 28
     2:00 pm – 5:30 pm

SP5: Current Topics for Power Electronics Research 

Session Chair: Joshua Israelsohn, JAS Technical Media

SP5.1: Power Electronics Research at the University of Padova
P. Mattavelli, University of Padova

SP5.2: Power Electronics Efforts at Intel
S. Chickamenahalli, Intel

SP5.3: Renewable Energies and Autonomous Power Systems
J. Sun, Rensselaer Polytechnic Institute

SP5.4: Power Electronics Related Research at the University of Alabama
T. Haskew, University of Alabama

SP5.5: Power Electronics Research at Queen's University
Y.F. Liu, Queen's University

SP5.6: TBD
L. Tang, ABB Corporate Research Center

SP5.7: TBD
F. Rahman, University of New South Wales

 

 
< Prev   Next >

Home | About APEC | Participating in APEC | Exposition | Hotel and Travel | Authors and Presenters | Publications | Free Downloads | Committee | Contact Us | Policies and Procedures | Help with Joomla |

| © APEC - The Applied Power Electronics Conference and Exposition 2008 |
| design by Shakespear Design |