Professional Education Seminars |
Sunday, February 21, 2010
9:30 am - 1:00 pm
2:30 pm - 6:00 pm
Monday, February 22, 2010
8:30 am - Noon |
S.1 Controlling Conducted and Radiated EMI Issues in Power Electronics Designs
Supratim Basu, Bose Research (P) Ltd.
While management of EMI in Power Electronics design has always not been very straightforward, today’s demand for power converters having higher power densities and efficiencies makes EMI management even more challenging. While higher power densities make the converter’s EMI filter very susceptible to internal fields, demands for fast switching speeds of switching devices to minimize switching losses and improve efficiency, also increases EMI significantly. Thus as higher power densities and efficiencies driving today’s designs conflict with the general rules of EMI management, the general design approach of using the best highest inductance filter after completing design often usually never works, resulting in significant project delays. Therefore understanding the generation of EMI and its reduction at source during design, is the key to controlling EMI.
This intermediate to advanced level course will begin with a refresh on EMI basics followed by an in-depth treatment of various topics like heat-sink grounding, transformer screens, using ferrite beads, filter design, PCB layout, Mosfet switching speed, etc. Lastly the focus of this presentation is to present everything with as many practical engineering examples as possible and thus have a mix of both practice and theoretical explanations and not focus only on field/wave theory or physics.
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S.2 Current State and Future Improvements of GaN Based Power Conversion
Tim McDonald, International Rectifier
GaN on Si based power conversion has received a lot of recent public notice and has been positioned as a “next generation” solution to provide sustained dramatic improvement in switch performance at a time when silicon power transistors are approaching some physical limits in performance. This seminar is directed towards the intermediate to advanced level audience of power design engineers, systems engineers, component engineers and power design managers. Seminar attendees will witness GaN power conversion in a host of applications from point of load to PFC and will be brought up to date on the progress GaN on Si has made from prototypes to products. Modeled and actual performance benefits will be studied. The observant student will walk away educated on the current benefits and future prospects of GaNpowIR conversion.
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S.3. Virtual Prototyping of Power Supply Designs
Thomas Wilson, Simplis Technologies, Inc.
The rising cost of failure coupled with the falling cost of simulation produces compelling benefits for the creation of virtual prototypes to verify designs of new power supplies before initial hardware builds.
This seminar provides practical guidance on how the use of circuit simulation can improve real world design verification processes and reduce the number of design errors that get committed to hardware. By focusing heavily on real-time demonstrations and comparison of simulation results with measured lab data, this seminar will focus on practical detail valuable to both experts and engineers just beginning to incorporate simulation into their design processes.
The Virtual Design Verification process is explored from three perspectives, that of the Power Supply designer, the Controller IC architect and the Power System designer. Leveraging the advantages of Piecewise Linear (PWL) analysis, practical simulation test suites will be discussed including Line and Load Regulation, AC Analysis (Bode Plots, Input and Output Impedance), Step Line and Load Transients, and critical Device Losses and Stresses.
This presentation seeks to balance practical “how to” information with big picture “why bother” examples. While the primary simulation engine used in these examples is SIMPLIS, the presentation is neither a sales pitch nor a “how to push the buttons” demonstration. Rather, practical examples of real circuits will be used to discuss the range of critical factors that must be addressed in order to use simulation to provide breakthrough value in the day-to-day design and qualification of switching power supplies.
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S.4. Designing Compensators for the Control of Switching Power Supplies
Christophe Basso, ON Semiconductor
Switch Mode Power Supplies are widely used in nowadays equipments, ranging from a few tens of watts in consumer applications to several hundred of watts and above in industrial applications. Despite the various architectures found in this field, they all share the need for a control circuit that maintains one or several delivered variables within a defined range. The compensator is the place where the designer will place the poles and zeros to shape the loop frequency response and ensure stability over the entire operating range. Depending on the selected controller, the available active element to perform the compensation can be an operational amplifier, a transconductance amplifier (OTA) or a TL431. Unfortunately, available textbooks solely focus on the first type, leaving both the TL431 and the OTAs apart despite their popularity in the power electronics field.
Targeting practicing engineers and graduating students, this seminar describes how to efficiently compensate a power converter using an operational amplifier, an OTA or a TL431. All compensator types such as 1, 2 and 3 are covered in great details, with design examples used as a support. The seminar starts by teaching how to optimally select the crossover frequency and the phase margin in relationship with your design specifications. The presentation then shows what poles and zeros are and how they must be placed to precisely shape your compensator response. At the end of the presentation, the audience will have a complete description of the three compensators types implemented with the op amp, the OTA or the TL431. Using mathematical analysis and SPICE, the author maintains a permanent link between what theory dictates and what the market reality is. Up to four design examples are used to apply the theory described in the presentation.
The seminar balances analytical aspects and real case examples to show how to design a stable power supply. It targets an audience with an intermediate background in the presented subject.
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S.5. New Trends in Magnetic Technology
Dan Jitaru, Delta Corporate Services
The updated seminar will present a comprehensive overview of the latest trends in magnetic technology. In the quest for higher power densities and higher efficiency, the magnetic structures have evolved continuously and some new concepts have emerged. The main goal of the seminar is to underline some progress made in magnetic technology and to place some light in potential developments in the future.
The seminar will not be focused only on magnetic as an isolated component but as part of the power converter design which also includes the topology, packaging and even the control. There will be presented many forms of magnetic structures in close correlation with converter topologies with emphasis on the latest trends. Different forms of integrated magnetic and new magnetic technologies, referred in the seminar as “magnetic integration solutions” will be also presented.
The latest magnetic technologies referred in this seminar as “ultra-planar magnetic” will be also presented. This new magnetic technology allowed us to push the envelope of power density to the highest level in the industry. The presentation will be highlighted with design guidance, design example and experimental results.
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S.6. Power Electronics in Battery Powered Applications: Safety, Charging, Monitoring, and Power Conversion
Jinrong Qian, Texas Instruments
Power Electronics has played a very important role in battery powered devices. Battery power management continues to be significant issues for a wide range of portable devices. “How can I charge the battery faster, make the system run longer, and use the battery energy more efficiently?” has plagued designers and users. This seminar addresses the issues surrounding battery power management and how battery management power electronics smartly monitors the battery, efficiently use the battery energy, and extends the battery runtime.
The first part of the presentation provides the battery electrical behavior, charging and discharging characteristics, cycle life, and safety protections including over-charging, over temperature, over-current and short circuit in battery packs. It also includes how battery electronics improves the battery safety.
The second part is focused on how to monitor the battery remaining capacity for extending battery run time. Too early shutdown the system will not fully use the energy from the battery for low accuracy fuel gauge. High accuracy fuel gauge is the same important as the power conversion efficiency. We are going to review the most commonly used monitoring approaches: coulomb counting, voltage measurement based and 99% accuracy impedance track based fuel gauges. System side fuel gauge along with the design challenges will be discussed in detail.
The third part of the presentation is to talk about the new industry charging standards, review the battery charging system architecture, interaction between system and charger. Dynamic Path Management (DPM) technology is going to be presented to maximize use of the AC adapter power while charging the battery and supplying the system simultaneously. Both bus-voltage based and input-current based DPM battery charging architectures and implementation will be presented. Then, we will present how to efficiently the power from the USB port to charge the battery faster and support USB On-The-Go applications with a 3 MHz synchronous switching battery charger, practical switching mode chargers and their control integrated circuits (ICs) are going to be presented for portable devices.
The fourth part of the seminar will talk about how to improve the light load efficiency in DC-DC converter. Particularly, Pulse Frequency Modulation (PFM) and low power saving mode are used to reduce the switching frequency and minimize the quiescent power dissipation for improving battery standby time. Then we will present voltage scaling technique to dynamically adjust the CPU core voltage in DC-DC converters, and some practical implementations and test results will be provided. To minimize the size and improve the power density, 6MHz DC-DC converter will be discussed. Finally, High integration Power management ICs (PMICs) are also discussed for further minimizing the total solution size and improving system efficiency for extending the battery runtime.
This seminar is structured to provide in-depth coverage of the topics of the power electronics in battery powered applications, and is intended for the audience from entry level to intermediate experience level.
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S.7. EMC for Power Supply Designers
Ernest Wittenbreder, Technical Witts, Inc.
The purpose of this course is to provide the power supply design engineer with a better understanding of the scientific and engineering principles of EMI generation, coupling mechanisms, EMI avoidance, and EMI reduction techniques and to provide the engineer with very specific practical information that he can use to accomplish low noise power supply designs. Circuit synthesis methods that can be used to form new power supply topologies with improved EMC compared to standard well known topologies will be presented. New simple circuit topologies with EMC and efficiency advantages will be described. An exhaustive review of the many typical EMI problem areas is provided and proven methods are described to avoid those problem areas. PWB layout techniques and techniques applicable to construction, component design, circuit and component placement, shielding, and snubbing will be presented. The student will learn about EMI filter design, and EMI filter component and interface issues. This course will be a benefit to all power supply design engineers regardless of their level of experience and ability.
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S.8. Application Characteristics of IGBT Power Modules
John Donlon, Powerex
Information provided on IGBT module data sheets varies considerably between manufacturers and can leave the designer with many questions regarding device selection. Issues the designer must deal with include interpretation of device ratings, gate drive requirements, and providing device and system protection. The intent of this seminar is to aid the designer in applying an IGBT to a new product. Questions and concerns a designer might have will be addressed by the various techniques and circuit examples that will be presented. IGBT chip technology and device packaging options will also be discussed. The attendee should leave the course with a better understanding of the IGBT, both specifically as a device and how it functions in an application. The goal will be to impart an understanding of the desirable features, characteristics, and limitations of the IGBT. This will include the application of IGBTs in power circuits, protecting the IGBT from internal and external disturbances, and an understanding of thermal design and handling considerations. The seminar is intended for design engineers new to IGBTs as the main switch in power conversion equipment as well as refresher for the experienced designer with questions about confusing or conflicting information on the data sheets from various manufacturers. It should also be of interest to those who use, apply, procure, or specify power electronic products based on the IGBT as the power switch.
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S.9. Simulation, Control, and Measurement of DC-DC Converters
Ray Ridley, Ridley Engineering
This seminar will present an in-depth discussion of the many issues involved in controlling dcto- dc and ac-to-dc converters. Many aspects of the design of control systems will be covered, including the role of simulation and measurement, topologies, modes of operation, passive components, compensation, PFC circuits, multiple output converter, and filters. Live demonstrations will be presented of loop gain and impedance measurements on working converters and power stage components. The course is recommended to all levels of engineers who work with switching power supplies at power levels from less than 1 W to 100 kW.
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S.10. Thermal Management for Power Electronics Applications
Ahmed Zaghlol, R-Theta Thermal Solutions Inc.
This course gives an overview of the thermal management for power electronics. As the density of circuits increases, so does the need to develop effective methods of thermal management and packaging. This need arises not only in the context of high-speed computers but also, in future UPS, power supplies, Converters, Variable speed motor drives, RF and Microwave amplifiers and automotive applications. This course helps engineers to develop thermal management knowledge that address both emerging thermal challenges and significantly improve thermal performance.
This course is designed to provide participants with an over view of the necessary tools to perform thermal modeling and analysis of electronic systems. The fundamental and applied methods for a successful design are covered, and modeling tools are reviewed. The course outline will include the following topics:
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Definition of electronics cooling and encountered challenges.
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General problem solving technique for solution of thermal problems.
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Heat transfer and fluid mechanics fundamentals as applied to electronics cooling.
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Thermal design for the interface between the device and the heat sink.
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Heat sink design with reference to performance and overall system design.
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System thermal and Hydraulic performance.
An extended form of this course was presented to a Global OEM of variable speed motor drives in the USA. The course was presented over 2 days as a professional course for 14 engineers.
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S.11. The Semiconductor Cycle Bites
Ada Cheng, Accolade
Avoid the semiconductor cycle’s bite and benefit from its various aspects. An introduction to the semiconductor cycle from a business and marketing perspective: how the cycle works, how to manage through various parts of the cycle and understand various perspectives from difference stakeholders. Moreover managers will learn to capitalize on key business and marketing aspects of the semiconductor market.
This seminar is ideal for:
- Managers from companies that market/manufacture semiconductors
- Purchasing managers of semiconductor customers
- Managers who supply materials/equipment/services for semiconductor manufacturers
- Managers in distribution
- Financial analysts
- Anyone else that might be interested in the convoluted electronics supply chain
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S.12. Power Conversion Reliability
Don Gerstle, Murata Power Solutions
Power conversion reliability is crucial to overall system reliability, and lack thereof is sometimes the top cause of system failure. This is an in-depth treatment of the topic for an intermediate level audience, starting with a definition of reliability and different ways to predict it.
An explanation of how to achieve high reliability in over 80 areas in design and manufacturing follows. This includes comprehensive specification development, good design processes, and proper component selection. Thermal aging in magnetics, cracked capacitors, opto-isolator CTR degradation, daisy-chained power supplies, and connector fretting are covered, with methods outlined on how to deal with each of these issues.
The impact of testing processes on reliability is covered, including sample size versus production yield statistics. Metal whiskers can affect reliability. This tells where they occur, and how to mitigate them. Corona is reviewed, with a discussion of how it’s a factor in high voltage and high-density lower voltage supplies, with steps to prevent / eliminate it. Future reliability trends are the final subject matter, with a number of areas presented, including the new IPC-9592 Standard, along with prognostics. Numerous pictures, graphs, and charts are used to support and clarify points made during the presentation.
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S.13. EMI Causes, Measurement, and Reduction Techniques for Switch-Mode Power Converters
Michael Schutten, GE Global Research
This seminar is intended as a comprehensive introduction for engineers wishing to obtain a fundamental understanding of EMI issues associated with switch-mode power converters, and experienced engineers desiring a detailed understanding of electromagnetic interference (EMI) causes and fixes for power converters.
The seminar begins with an introduction to noise coupling mechanisms and their properties. The concept of impedance mismatch is presented as a basis for understanding filtering concepts. Differential-mode (DM) and common-mode (CM) separation and filtering approaches are derived, and measurement and separation techniques presented. DM & CM measurement and EMI reduction techniques are presented for an experimental flyback converter. Converter layout techniques and principles are derived, and experimentally verified. The seminar provides an emphasis on how DM and CM currents are created in power converters, and layout and construction techniques to minimize the need for costly filtering. Several practical EMI reduction techniques and construction methods are provided throughout the presentation.
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S.14. Silicon Carbide Characteristics and Application
Robert Callanan, Cree, Inc.
This seminar will be an in-depth discussion of characteristics and application of silicon carbide (SiC) 1200 V, 20 A DMOSFETs from the experienced user’s perspective. The SiC DMOSFET has the advantages of low conduction and switching loss along with higher operating temperature capability. However, the operating characteristics of this device are different from what is usually expected from Si MOSFETs super-junction MOSFETs, and IGBTs. The chief purpose of this seminar is to provide an understanding of these differences so that the SiC DMOSFET can be applied to its fullest potential. This will be achieved by a discussion of the operating characteristics of the SiC DMOSFET and how they differ from representative Si MOSFETs and IGBTs. This will include comparisons between DC output characteristics, forward conduction, transfer curves, leakage current, gate charge, switching, and body diode considerations. Application considerations will also be discussed throughout. This seminar will also include a brief description of the operating characteristics of the SiC bipolar junction transistor (BJT) which is an attractive device for power conversion applications.
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S.15. CAD of Power and Control Systems of Electric Machines
Tanvir Rahman, Infolytica Corporation
This seminar will deal with the CAD of electric machines and their power electronics and control systems. Although machine design including its drive system have traditionally been considered separately, modern CAD tools are making it increasingly feasible to implement an integrated design process in which machine dimensioning, design verification, inverter and control system designs can be carried out simultaneously. This integration is a sub-field of the emerging field of mechatronics. In this seminar, the state of this technology for power and control system design of electric machines will be reviewed and demonstrated using industrially relevant examples. The seminar will include a review of machine types, design algorithms, design strategies for power and control systems, CAD and analysis tool requirements and demonstrations using a BLDC, an induction motor and a switched reluctance machine. The focus will be to understand first, considering the design algorithms and computational challenges, how best to implement an integrated design approach. Some practical examples of this are presented using some state-of-the-art CAD tools.
Although the material presented in this seminar will primarily be a survey of the field, it will however contain technical details and results that will be of interest to attendees from the entry to the advanced level.
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S.16. Analog and Digital Feedback Loop Design
Dean Venable, Ablepower Corporation
I gave my first seminar on feedback loop design in 1979, 30 years ago. Since then, I have given many more seminars on the subject but have found it takes a long time to educate the world. Now the world is going digital. New graduates are going to find digital solutions for everything, including feedback loops. I invented the K-Factor approach that allows one to stabilize any analog feedback loop with the desired bandwidth and phase margin on the first try. Since then I have been searching for a method for stabilizing digital feedback loops as quickly and easily as analog feedback loops. Now I have such a method, which is what this seminar is all about. I will discuss the three basic types of analog feedback amplifiers, Type 1, Type 2, and Type 3, and show how they directly relate the three types of digital feedback compensators, I, PI, and PID. Anyone with a degree in Electrical Engineering should be able to follow this seminar. I plan to have a live demonstration showing how to measure digital loops as easily as analog loops. Everyone in the audience will learn how to stabilize a feedback loop by actually doing it.
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S.17. Systematic Design for High Efficiency
Dhaval Dalal, ACP Technologies
Emerging global emphasis on eco-friendly design has brought efficient power electronics closer to the center-stage of system design considerations. As power electronics professionals, we have to respond by learning and adapting to newer/better ways of doing our jobs to be more effective and more efficient. In this seminar, we will explore different development models as they apply to power electronics design and evolve the hierarchical approach that is the most suitable for present-day requirements. Each stage of the hierarchical approach, which forms the next level of the pyramid – culminating in a pinnacle that signifies successful product is discussed. The foundation is laid by strong product definition comprising of clear specifications and an appropriate architecture. The next level is the complete product design using appropriate toolkit (e.g. simulations, prototyping, analyses etc). The final layer is product validation and testing. The effectiveness of this approach is shown through many power electronics related design examples and tools. Along the way, the limitations of some common design thumb-rules are exposed and common assumptions are challenged. The ultimate objective of this seminar is to present a strong case that with a correct design approach, low cost and high efficiency are not mutually exclusive goals to strive for.
S.18. Power Electronics in a Smart-Grid Distribution System
Doug Hopkins, University at Buffalo
Power Electronics is an integral part of the Future Smart-Grid Distribution System, particularly as multiple opportunities are availed with the introduction of more DC generation and distribution. However, the fundamentals of power flow and system dynamics are the same from transmission through distribution to end-use. This seminar focuses on how power electronics affects power flow in grid distribution and distributed energy systems, and what power controllers need to do to offer greater benefits to system stability and economic resource.
A distributed generation system, as found in a smart grid interconnection of several intermittent power sources, e.g. batteries, fuel cells, PV and wind turbines, is used to describe power electronic networks that affect the basics of power flow control and transient system stability. Topics are introduced from ‘an electronics processing perspective’. With the move to greater DC generation and direct load usage, a good segment is devoted to DC system challenges for cabling and protection.
The attendee is expected to be a power electronics designer needing to gain a “power systems” understanding of alternative power generation, smart-grid distribution and system control. This is an excerpt from a formal university course taught to power utility engineers.
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