About the RAP Sessions

RAP Sessions allow for exciting dialogue among attendees and presenters. Admission to all Rap Sessions is free with an Exhibits Only Registration.

Following is the schedule for the RAP Sessions at APEC 2020:

Tuesday, March 17

5:00 p.m. - 6:30 p.m. (concurrent sessions)

Session 1: Distributed vs. centralized control for micro-grid and nano-grid.

Moderator: Alix Paultre, Open Systems Media

Panelists:
Vipin Bothra, ST microelectronics
Madhav Manjrekar, University of North Carolina in Charlotte
Ali Husain, ON Semiconductor
Raghavan Nagarajan, Wind and Transmission & Distribution (T&D)
John Lannan, Analog Devices
Matt Baker, Microgrids and Critical Power, Typhoon HIL

Abstract:
The ongoing migration towards more automated and self-sufficient facilities and campuses continues, there are issues of control and oversight that need to be addressed. One question is the developing debate between next-generation wireless in the Cloud and Edge Computing, for example. The related area of interest in the power space is the question of centralized or decentralized control in a micro- or nano-grid. Just as the IT world is trying to define the technologies and applications at the edge of the Cloud, so too must the power industry define its scope within the smart environment created.

In this session the panel will discuss and debate the merits of distributed vs. centralized power distribution in microgrids and smart facilities. On the one hand, although micro-grids themselves represent a form of decentralization in and of itself in regards to the local power grid, how that power is deployed within the micro-grid must also be determined. The panel is made up of two teams: one for centralized power, and one for distributed power. Both approaches have their merits, and our panel members will present their ideas and views on which is most appropriate. Please join us and debate this topic with our expert panelists.


Session 2 : Does high level of integration make power converters more reliable or not?

Moderator: Indumini Ranmuthu, Texas Instruments

Panelists:
Madhu Chinthavali, Oakridge National lab
Robert Pillawa, University of Berkeley
Sandeep Bahl, Texas Instruments
ChengChi Chen, Ford
Huai Wang, Aalborg University
Craig Popken, Artesyn

Abstract:
There is significant trend in the industry towards higher power density and integration in power supplies. Progress made in wide bandgap devices and power packaging has accelerated this trend. Given this the reliability of wide band gap devices, new magnetics and advanced packaging now directly influences the system reliability. As power density goes up it tends to affect thermal signature as well.

In cases where total power loss is reducing due to SiC, GaN the cooling systems can be simplified and made to be more reliable. Also integration has allowed enhanced protection and reliability features to be implemented. From a practical stand point reliability can have a tradeoff with cost as well. As we all know industry wants reliable and cost effective products.

In this session, the panel will discuss, debate the merits and challenges of high level of integration in power systems. Please join us and debate this topic with our expert panelists and find out the state of the art!


Session 3: Where does the expertise for the next generation of magnetics come from? The Magnetics companies, or the engineer designing the power supply?

Moderator: Kevin Parmenter

Panelists:
Paul Greenland, Analog Devices
Paul Yeaman, Vicor
Dan Jitaru, Rompower
Brooks Leman, Maxim Integrated
Jim Marinos, Payton Magnetics
Ray Ridley, Ridley Engineering
Kevin Enser, Renco Electronics

Abstract:
The next great frontier in power supply design is magnetics. Decades of investment in semiconductor technology has given us a wide array of almost-perfect switches, but to take full advantage of this, we are going to need new technology for the inductors and transformers.

Who is going to do this work? Will it be the magnetics manufacturers or the power supply designers? Manufacturers have a deep knowledge of materials and processes needed to assemble components. However, the circuit designer has an intimate knowledge of all the topologies available, the waveforms and harmonic content. Perhaps the semiconductor companies doing the reference designs have this knowledge or could it be something else? Who is most qualified to assess the performance of new designs?

In this lively rap session, we will look at the paths available for future progress. Highly qualified panel members from all sides of the issue will provide an entertaining and informative evening that is not to be missed.

*speakers, times, and topics subject to change.