About the RAP Sessions
The APEC RAP Sessions feature several exciting and contentious topics. RAP Sessions allow for exciting dialogue among attendees and presenters and are presented live during the conference.
The RAP sessions at APEC 2022 took place Tuesday, March 22, 2022 from 5-6:30 p.m. CT. Topics included:
RAP Session 1: Switch Capacitor vs. Inductor Based Topologies
Chair: Jonathan Kimball – Missouri University
Robert Pilawa – University of California Berkeley
Loai Salem – University of California Santa Barbara
Jose Cobos – Universidad Politécnica de Madrid
Roger Chen – Texas Instruments
Nicola Femia – University of Salerno
Dr. Jinghai Zhou - Monolithic Power Systems
In the search for higher power density, higher efficiency, and lower cost, power supply designers have pursued a wide range of alternative topologies. The panelists for this session have explored different topologies that are centered on either switched capacitor structures or inductors. Come explore the benefits of each approach and the applications where they can provide distinct benefits, and learn from experts about their vision for the future of high-density power conversion!
RAP Session 2: Challenges and potential of “AI based design” vs. “conventional design"
Chair: Alan Mantooth - University of Arkansas
Alfonso Martínez – Frenetic
Minjie Chen – Princeton University
Joao Pinto – Oakridge National Labs
Alex Huang – University of Texas at Austin
Rolando Burgos – Virginia Tech
Dragan Maksimovic – University of Colorado Boulder
The past few years have seen a remarkable growth in artificial intelligence in many applications. Power electronics is no exception in that researchers are investigating new ways to model and design power electronics using some form of artificial intelligence. This panel is comprised of several thought leaders in the area of power electronics design – both utilizing AI techniques and without. They will discuss aspects of power electronics design that AI can improve or at least provide keener insight, and where traditional design methods remain superior or necessary. Come join us to open your mind to whether new approaches are worthy of your consideration in your next design. Hearty participation is welcome!
RAP Session 3: Magnetics in IC vs. Magnetics in PCB
Chair: Indumini Ranmuthu – Texas Instruments
Matt Wilkowski – Enachip
Francesco Carobolante – IoTissimo
Alex Hanson – University of Texas at Austin
P. Markondeya Raj - Florida International University
Doug Hopkins – North Carolina State University
Khurram Afridi – Cornell University
Cian O'Mathuna - Tyndall National Institute
As the journey to miniaturize the power supply and quest for higher efficiency continues, integration of magnetics creates new challenges and opportunities. To this effect a considerable amount of innovation has been done to integrate magnetics in ICs and PCBs. This includes Magnetics implemented on chip, in package, embedded in PCB, on PCB and new magnetics technologies. Each approach has its own tradeoffs in terms of efficiency, size, power delivered, reliability, cost and EMI. What would be the right approach for your application? Come join the panel of experts in a spirited debate to get your questions answered, learn about the state of the art and explore the future of Magnetics integration!