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Exhibitor Seminars

APEC 2019 Exhibitor Seminars will highlight new products or initiatives that companies in the power electronics industry are developing, along with allowing the opportunity for attendees to interact with other companies in the industry. For questions, please contact exhibits@apec-conf.org for more information.

View all session descriptions here.

Date/Time Company Name Title Speaker Session Description Room Number
Tuesday, March 19, 2019-3:00PM-3:30PM Alpha and Omega Semiconductor A New Compact SMD-Type Intelligent Power Module In-Wha Jeong View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019- 1:30PM-2:00PM Analog Devices ADI’s Power by Linear Portfolio: Silent Switchers & Micromodule Regulator Products Tony Armstrong
Product Marketing Director
View Session Description Here 211AB
Wednesday, March 20, 2019-11:15AM-11:45AM Apex Microtechnology Pushing the Limits of Analog Power Jens Eltze View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019- 1:30PM-2:00PM AVX MLCC and Tantalum Electrolytic Capacitor Interchangeability in High Capacitance Applications Chris Reynolds – AVX Corporation  View Session Description Here 212AB
Wednesday, March 20, 2019-12:00PM-12:30PM Bose Research ltd Simplifying your Power Supply Designs, including EMI & Safety   View Session Description Here 211AB
Wednesday, March 20, 2019-12:00PM-12:30PM Changsung Corporation HYBRID MAGNETICS   View Session Description Here 212AB
Tuesday, March 19, 2019-3:00PM-3:30PM CogniPower Simplifying Efficient Low Power AC/DC Converters Tom Lawson, President  View Session Description Here 211AB
Wednesday, March 20, 2019-10:30AM-11:00AM Coilcraft, Inc. New Thinking Leads to Smaller Inductors and High Efficiency at High Frequency Len Crane View Session Description Here 211AB
Wednesday, March 20, 2019-10:30AM-11:00AM Danfoss Silicon Power GmbH Next Gen Automotive Power Modules: DCM™ platform by Danfoss Silicon Power Brian L. Rowden View Session Description Here 212AB
Tuesday, March 19, 2019-3:00PM-3:30PM Efficient Power Conversion Corporation (EPC) GaN’s Frontal Assault on Silicon at 48 Volts Alex Lidow Ph.D., CEO, Efficient Power Conversion View Session Description Here 212AB
Tuesday, March 19, 2019-3:00PM-3:30PM Fuji Electric Corp. of America Introduction of RC-IGBT Alexander Theisen View Session Description Here 213C
Wednesday, March 20, 2019-10:30AM-11:00AM GMW Associates Test Instrumentation for Electric Vehicle Battery and Charging Systems Ian Walker View Session Description Here 213C
Wednesday, March 20, 2019-12:00PM-12:30PM HBM Test and Measurement Accelerate Motor Testing and Development Up To 100X Mike Hoyer – HBM Test and Measurement, Applications Engineer View Session Description Here 213C
Wednesday, March 20, 2019-11:15AM-11:45AM Helix Semiconductors Realizing a Transformerless Future Bud Courville View Session Description Here Exhibit Hall Show Floor: Theater 1
Wednesday, March 20, 2019-11:15AM-11:45AM Henkel Company THE INFLUENCE OF ASPECTS OF SOLDER PASTE FORMULATION AND SOLDERING PROCESS FACTORS ON VOIDING UNDER LARGE QFN DEVICES Dr. Neil Poole View Session Description Here 211AB
Tuesday, March 19, 2019: 3:45PM-4:15PM Holy Stone International Filling in the Multilayer Ceramic Capacitor Gap Tom Stoddard, Vice President/COO, Holy Stone International View Session Description Here 211AB
Tuesday, March 19, 2019- 1:30PM-2:00PM Infineon Technologies Americas Inc Infineon’s GaN & SiC devices for High Performance Power Electronic applications Steve Bakos View Session Description Here 213C
Wednesday, March 20, 2019-12:00PM-12:30PM Instek America Instek Value Proposition and Power Supply Testing Solution Johnson Huang View Session Description Here 213D
Wednesday, March 20, 2019-11:15AM-11:45AM ITG Electronics Inc. Electrical Noise Suppression and Common Mode Choke Rickey Cheang, Field Application Engineer at ITG Electronics Inc. View Session Description Here 212AB
Tuesday, March 19, 2019: 3:45PM-4:15PM Littelfuse, Inc. Innovative Packaging Plans for Littelfuse SiC Devices Christophe Warin (SiC Product Marketing Manager) View Session Description Here 212AB
Tuesday, March 19, 2019-2:15PM-2:45PM Magnetics New Powder Core Materials for High Frequency and High Current Mark Swihart View Session Description Here 211AB
Tuesday, March 19, 2019: 3:45PM-4:15PM Siemens PLM Improving Power Module Thermal Design & Reliability with IGBT Testing & Automatic Calibration of Simulation Models Andras Vass-Varnai, Joe Proulx View Session Description Here 213C
Tuesday, March 19, 2019-3:00PM-3:30PM Mersen Improving Safety & Reliability for Power Electronics   Mr. Kian Sanjari – Marketing and Training Manager View Session Description Here 213D
Tuesday, March 19, 2019- 1:30PM-2:00PM Microchip  Dual-core DSCs for Digital Power Conversion Tom Spohrer View Session Description Here 213D
Tuesday, March 19, 2019-2:15PM-2:45PM Mitsubishi Electric US, INC The LV100 and HV100 New Standard Modules for High Power Applications Eric R. Motto,  Chief Engineer – Power Semiconductor Applications View Session Description Here Exhibit Hall Show Floor: Theater 1
Tuesday, March 19, 2019-2:15PM-2:45PM Mouser Silicon Carbide… A brief overview: Where we are, Where we’re headed, and Tips for Successful Use. Mitch Van Ochten | Applications Engineer View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019- 1:30PM-2:00PM Navitas Semiconductor What are you waiting for? Let’s go GaNFast! Stephen Oliver, VP Sales & Marketing View Session Description Here Exhibit Hall Show Floor: Theater 1
Wednesday, March 20, 2019-10:30AM-11:00AM NH Research Battery Emulation for Powertrain & DC Fast Charger Testing Martin M Weiss – Product Director View Session Description Here 213D
Tuesday, March 19, 2019: 3:45PM-4:15PM Nichicon (America) Corp New Small Li-Ion  Rechargeable Batteries in a Capacitor Package Mark Gebbia View Session Description Here 213D
Tuesday, March 19, 2019- 1:30PM-2:00PM ON Semiconductor  Satisfying the  pressured designer's wish list with all the right tools in just one toolbox Dave Priscak View Session Description Here 303AB
Wednesday, March 20, 2019-10:30AM-11:00AM OPAL-RT TECHNOLOGIES Real-Time Simulation: Helping the World Build Better Products Martin Belanger
Director, Sales, North America
martin.belanger@opal-rt.com
View Session Description Here Exhibit Hall Show Floor: Theater 1
Tuesday, March 19, 2019: 3:45PM-4:15PM Pacific Sowa Corp C/O Epson Atmix Corp High Reliability Soft Magnetic Powder for Automotive Inductors Yoshizawa Masahito View Session Description Here 303AB
Tuesday, March 19, 2019-3:00PM-3:30PM Panasonic X-GaN Power Transistor Breakdown Mechanisms Tom Higuchi View Session Description Here 303AB
Wednesday, March 20, 2019-11:15AM-11:45AM PEM Ltd Delay, rise-time and slew rate using CWT HF optimised Rogowski current sensors in Power Electronics' Dr Chris Hewson View Session Description Here 213C
Wednesday, March 20, 2019-11:15AM-11:45AM Plexim Code Generation and Real-time Simulation with PLECS and the RT Box Bryan Lieblick View Session Description Here 213D
Wednesday, March 20, 2019-10:30AM-11:00AM Power Integrations Death to Heatsinks Doug Bailey- Vice President of Marketing View Session Description Here Exhibit Hall Show Floor: Theater 2 
Wednesday, March 20, 2019-11:15AM-11:45AM Preen AC Power Corp. Factors in Selecting Programmable AC Power Sources Brian Hsu View Session Description Here 303AB
Wednesday, March 20, 2019-11:15AM-11:45AM pSemi, A Murata Company Novel Two-stage Bucks Achieve Unprecedented Efficiency in Ultra-low Profile and Footprint for Powering DDR5 Memory, ASICs and FPGAs Stephen Allen View Session Description Here 303CD
Tuesday, March 19, 2019: 3:45PM-4:15PM Ridley Engineering, Inc. Magnetics Modeling And Software Dr. Ray Ridley View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019-3:00PM-3:30PM Rogers Corporation Curamik ceramic substrates and laminated busbars solutions for Power Electronics Dominik Pawlik & Olivier Mathieu View Session Description Here Exhibit Hall Show Floor: Theater 1
Wednesday, March 20, 2019-12:00PM-12:30PM Rohde & Schwarz Oscilloscopes: An all-in-one solution for power electronics design  - From switching and frequency response analysis to EMI debugging Mike Schnecker View Session Description Here Exhibit Hall Show Floor: Theater 1
Tuesday, March 19, 2019: 3:45PM-4:15PM SBE, Inc. Optimal DC Link Topologies for Best Utilization of Switch Modules Michael Brubaker View Session Description Here 303CD
Tuesday, March 19, 2019: 3:45PM-4:15PM Schunk Carbon Technology GmbH Advanced Solutions for Energy Storage and Heat Dissipation Issues in Power Electronics Dr. Sandra Reisinger View Session Description Here Exhibit Hall Show Floor: Theater 1
Wednesday, March 20, 2019-10:30AM-11:00AM SEMIKRON Inc  Hybrid SiC Modules Optimized for Converter and Inverter Operations Kevork Haddad View Session Description Here 303AB
Tuesday, March 19, 2019-2:15PM-2:45PM SIMPLIS Technologies SIMPLIS Magnetic Design Module and User C-code DLL Defined Digital Device John Wilson and Andrija Stupar View Session Description Here 212AB
Wednesday, March 20, 2019-12:00PM-12:30PM Sino Nitride Semiconductor Advanced Manufacturing of GaN for Power Devices Joe Lu View Session Description Here 303AB
Wednesday, March 20, 2019-12:00PM-12:30PM Speedgoat Inc. HIL Testing and Controls for Power Electronics Made Easy with Speedgoat Real-Time Solutions Daniel Kraehenbuehl View Session Description Here 303CD
Tuesday, March 19, 2019-2:15PM-2:45PM STMicroelectronics Flexible Architectures to Efficiently Convert from 48V to Intermediate Bus or Directly to POL Paolo Sandri View Session Description Here 213C
Tuesday, March 19, 2019-2:15PM-2:45PM Texas Instruments Isolated Gate Drivers – how do I know which ones right for my application? Nagarajan Sridhar View Session Description Here 213D
Tuesday, March 19, 2019-3:00PM-3:30PM TT Electronics OPB9000 and Adaptable Sensors: Trends, Challenges and Developments Sergey Komarov View Session Description Here 303CD
Wednesday, March 20, 2019-10:30AM-11:00AM Typhoon HIL Inc. Ultra-High Fidelity Real-Time Simulation for Power Electronics and Microgrids Bozica Kovacevic View Session Description Here 303CD
Tuesday, March 19, 2019-2:15PM-2:45PM United Chemi-Con, Inc. Advanced capacitor technology for automotive applications Derrick Fitzpatrick View Session Description Here 303AB
Tuesday, March 19, 2019- 1:30PM-2:00PM Tektronix Challenges with Testing Wide Band Gap Power Converters Seshank Malap View Session Description Here 303CD
Wednesday, March 20, 2019-12:00PM-12:30PM West Coast Magnetics Challenges of Magnetic Component Core and Copper Loss Measurement Weyman Lundquist View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019- 1:30PM-2:00PM Wurth Electronics Avoid Designing Custom Magnetics by using REDEXPERT George Slama View Session Description Here Exhibit Hall Show Floor: Theater 2
Tuesday, March 19, 2019-2:15PM-2:45PM Yokogawa The Next Generation in Power Measurement Daniel Kasamis – Product Marketing Manager – Power Analyzers View Session Description Here 303CD