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Exhibitor Seminars

APEC 2019 Exhibitor Seminars will highlight new products or initiatives that companies in the power electronics industry are developing, along with allowing the opportunity for attendees to interact with other companies in the industry. For questions, please contact exhibits@apec-conf.org for more information.

Title Speaker Name Session Description Company Slot Assigned
A New Compact SMD-Type Intelligent Power Module In-Wha Jeong This seminar presents a new dual-in-line surface-mount device (SMD)-type intelligent power module (IPM7) solution specialized for low power motor drives applications such as fan motors of air-conditioning systems, which require highly compact size with reliable and efficient design allowance. Alpha and Omega Semiconductor Tuesday, March 19, 2019-3:00PM-3:30PM
ADI’s Power by Linear Portfolio: Silent Switchers & Micromodule Regulator Products Tony Armstrong
Product Marketing Director
This seminar will cover some of the basics of buck regulator operation including how high di/dt and parasitic inductance in the switcher “hot” loop cause electro-magnetic noise and switch ringing. It will cover how to reduce the high frequency noise. PC-board layout is critical to the success or failure of very power supply design. It sets functional, electromagnetic interference and thermal behavior. While switching power supply layout is not black magic – it is often overlooked until it is too late in the design process. Therefore, it will discuss proven way to mitigate these potential threats of EMI generation from the onset will ensure a quiet power supply. Silent Switcher technology will be shown, showing how it is constructed and it will describe how it helps to solve EMI problems without any compromises. Silent Switcher packaging and layout and discuss how these can enhance the overall performance of the step-down converters.
From here, micromodule regulators will be introduce, indicating how they are constructed with a description of the problems they solve. It will also cover their packaging trends and their quality levels. It will demonstrate their performance characteristic both from a thermal and form factor perspective, clearly showing their increasing power density in order to have a 100A output capable device in small footprint and able to deliver 100 Watts of power from 12V input to 1V output with 90 percent efficiency and only 200 LFM of air flow needed.
Analog Devices Tuesday, March 19, 2019- 1:30PM-2:00PM
Pushing the Limits of Analog Power Jens Eltze Apex Microtechnology’s Director of Strategic Marketing, Jens Eltze, will be discussing one of Apex’s new Power Op Amps and how to properly protect the device. The PA164 is a high-density power amplifier IC that utilizes MOSFET technology and a proprietary silicon design to deliver new benchmarks in performance and thermal management. Keeping the PA164 protected at high currents and voltages is critical to device success.  In this seminar, learn how fail safes such as temperature compensated current limit, over-current flags, and feedback loops are enlisted to ensure smooth amplifier operation.  Apex Microtechnology Wednesday, March 20, 2019-11:15AM-11:45AM
MLCC and Tantalum Electrolytic Capacitor Interchangeability in High Capacitance Applications Chris Reynolds – AVX Corporation  Over the years, ceramic capacitors have been used interchangeably with tantalum in many digital applications, class II ceramics being the one electrostatic technology that can achieve the high capacitance values typically associated with electrolytic capacitors. We are currently at a point where more electrolytic designs are being re-considered for applications that had switched to class II ceramic in recent years.
While most applications are amenable to such interchangeability, some parametric factors arise due to the differences in technology, so these need to be taken into consideration. This paper discusses the differences between electrostatic and electrolytic technologies, explaining the origin and effects of temperature and voltage coefficients, piezo and noise effects in class II ceramics, and polarity and ESR in solid tantalum electrolytic capacitors.
AVX Tuesday, March 19, 2019- 1:30PM-2:00PM
Simplifying your Power Supply Designs, including EMI & Safety     Bose Research ltd Wednesday, March 20, 2019-12:00PM-12:30PM
HYBRID MAGNETICS     Changsung Corporation Wednesday, March 20, 2019-12:00PM-12:30PM
Simplifying Efficient Low Power AC/DC Converters Tom Lawson, President  Ultra-efficient, small AC/DC converters can be
surprisingly simple. We achieve 96% efficiency at 10% of full load in
a power converter capable of several watts output. Transient response
is excellent and cost can be competitive with the lowest- cost
alternatives. The approach scales from under 1 Watt to 65 Watts. Secondary-side
control enables easy and direct digital interfacing. Adding CogniPower
Compound Converter Technology removes the upper limit.  Circuit
details will be provided. 
CogniPower Tuesday, March 19, 2019-3:00PM-3:30PM
New Thinking Leads to Smaller Inductors and High Efficiency at High Frequency Len Crane Selecting inductors and transformers for power converters often means invoking well-used rules of thumb. While these “rules” have been developed over many years and are based on real-life experience, it is necessary to move beyond them to truly optimize designs and achieve new size and performance targets. While it is usually assumed that inductor losses will increase at high switching frequency, for example, this presentation describes creative ways of viewing magnetic operation that can lead to surprising solutions with smaller passive components and higher efficiency. Coilcraft, Inc. Wednesday, March 20, 2019-10:30AM-11:00AM
Next Gen Automotive Power Modules: DCM™ platform by Danfoss Silicon Power Brian L. Rowden Danfoss has introduced the direct cooled molded (DCM) module technology for traction applications in hybrid electric and battery electric vehicles. The DCM™ technology platform is truly flexible in being  optimized to utilize Si, SiC or Si/SiC hybrid semiconductor setups. It ensures versatility and flexibility by allowing the customers to utilize scalable drive train inverters design approach. Using the same package and footprint for different inverter power classes opens the possibility to have scaling effects with the supporting hardware for the OEM’s. The presentation will demonstrate measurement results obtained from system level setups, it will also introduce performance results of SiC based power modules. Danfoss Silicon Power GmbH Wednesday, March 20, 2019-10:30AM-11:00AM
GaN’s Frontal Assault on Silicon at 48 Volts Alex Lidow Ph.D., CEO, Efficient Power Conversion In the past nine years, GaN-on-Si transistors and integrated circuits have enabled many extraordinary new applications such as LiDAR for autonomous cars, wireless power, and envelope tracking.  GaN integrated circuits have started to appear in USB-C adapters, UPS systems, drones, and a host of medical devices.  But the promise that GaN will crush silicon has not yet been fulfilled, until now.  With pricing of 100 V GaN transistors equally commercial power MOSFETs, coupled with their large performance advantages, there has been a groundswell of GaN adoption occurring at 48 V input DC-DC power supplies used in everything from AI machines, high-end servers, gaming machines, and now cars.  In this seminar, we will look at the front line of this adoption wave by showing examples of systems and quantifying the performance and cost edge GaN devices bring to the customer. Efficient Power Conversion Corporation (EPC) Tuesday, March 19, 2019-3:00PM-3:30PM
Introduction of RC-IGBT Alexander Theisen High-efficiency energy usage has become an extremely important factor in achieving a low-carbon society. A key to curbing the emissions of CO2- a major cause of global warming - is to take effective measures in the development of the power electronics devices used in the control of electric energy. Fuji Electric has developed and commercialized power semiconductors, which contribute to an overwhelming downsizing and efficiency improvement of power electronics equipment. In this session, we would like to present our 7th-Generation "X Series" RC-IGBT (Reverse Conduction IGBT) technology and industrial applications. Fuji Electric Corp. of America Tuesday, March 19, 2019-3:00PM-3:30PM
Test Instrumentation for Electric Vehicle Battery and Charging Systems Ian Walker For current control and metering, Fluxgate-based DC/AC Transducers offer current ranges to +/-10kA, better than +/-0.01% accuracy from dc to 2kHz, resolution of better than 4ppmrms broadband and  +/-1ppm per year dc stability. Rogowski Coil Clip-Around Coils with matching Analog Integrator enable measurement of ac current in the frequency range of a few Hz to 50MHz and can be optimized for accuracy and resolution at a specific frequency; a Probe for 85kHz Inductive Power Transfer (IPT) measurements is available with +/-300A range, amplitude accuracy of +/-0.3% and phase shift of <+/-1 degree. For IPT magnetic field measurement and mapping a 15x15x15mm Three-Component Magnetic Field Probe with field ranges to +/-10mT, 10kHz to 200kHz bandwidth. GMW Associates Wednesday, March 20, 2019-10:30AM-11:00AM
Accelerate Motor Testing and Development Up To 100X Mike Hoyer – HBM Test and Measurement, Applications Engineer Every lab has unique interests to characterize, test and validate electric motors and drives using multiple pieces of measurement equipment from different suppliers. While these systems work, they often have high levels of complexity and operate much slower than an optimized system. This presentation proposes a solution specifically designed for motor and drive testing, consolidating many systems into one which allows rapid efficiency motor mapping and custom advanced real-time analysis significantly boosting productivity, capability and research and development by many days. HBM Test and Measurement Wednesday, March 20, 2019-12:00PM-12:30PM
Realizing a Transformerless Future Bud Courville It’s an all-too familiar sight in today’s homes and businesses: a tangle of cords emerging from behind a console, desk or conference table, connected to several large, bulky power supplies. TVs, DVD players, set-top boxes, sound bars, digital media devices, monitors, printers, routers, laptops…the list of devices connected to these power supplies is seemingly endless. It doesn’t have to be this way, according to fabless power semiconductor company Helix Semiconductors.
Traditional power supplies are built around century-old methods. Transformers are the culprit here: they are big, cumbersome, heavy, inefficient, and inflexible, and they usually dictate the size and form factor of a power supply. Getting the maximum amount of power in the smallest space possible is the key to a new way of powering the world, and proprietary technology from Helix Semiconductors has accomplished exactly that. Come listen to our story and learn about how our MxC 200 and MxC 300 family of products enable a transformerless future.
Helix Semiconductors Wednesday, March 20, 2019-11:15AM-11:45AM
THE INFLUENCE OF ASPECTS OF SOLDER PASTE FORMULATION AND SOLDERING PROCESS FACTORS ON VOIDING UNDER LARGE QFN DEVICES Dr. Neil Poole   Henkel Company Wednesday, March 20, 2019-11:15AM-11:45AM
Filling in the Multilayer Ceramic Capacitor Gap Tom Stoddard, Vice President/COO, Holy Stone International “Filling in the Gap” is a presentation where we will discuss Multi-layer Ceramic Capacitor products that have been de-emphasized or even dropped by some of the largest MLCC manufacturers.  Holy Stone Enterprise Company focuses on many of these products providing an alternate source for some of these difficult capacitors to find.  Holy Stone has long been a leader in Safety Certified and High C/V MLCC’s which are precisely the area’s where many manufacturers are de-emphasizing or dropping these products entirely. Holy Stone International Tuesday, March 19, 2019: 3:45PM-4:15PM
Infineon’s GaN & SiC devices for High Performance Power Electronic applications Steve Bakos Infineon will review the advancements in GaN and SiC, including the applications, performance advantages, design considerations as well as the importance of quality and reliability when considering these technologies in customer designs.        Infineon Technologies Americas Inc Tuesday, March 19, 2019- 1:30PM-2:00PM
Instek Value Proposition and Power Supply Testing Solution     Instek America Wednesday, March 20, 2019-12:00PM-12:30PM
Electrical Noise Suppression and Common Mode Choke Rickey Cheang, Field Application Engineer at ITG Electronics Inc. At higher frequencies the impedance of a CM choke becomes an important factor to effectively
suppress EMI noise. This presentation will briefly discuss CM noise generators and how it can
be suppressed by using a CM choke. In addition, we’ll discuss impedance improvements by
using different winding techniques and wire shapes that enhance the performance and
efficiency of the CM choke.
ITG Electronics Inc. Wednesday, March 20, 2019-11:15AM-11:45AM
Innovative Packaging Plans for Littelfuse SiC Devices Christophe Warin (SiC Product Marketing Manager) This presentation will focus on future packaging plans for Littelfuse SiC devices. Details to be discussed include optimization of SiC device performance in standard and innovative discrete packages as well as exploring other packaging options that include surface mount power devices (SMPD) and standard industry power modules. Littelfuse, Inc. Tuesday, March 19, 2019: 3:45PM-4:15PM
New Powder Core Materials for High Frequency and High Current Mark Swihart Engineers find that powder cores are the best choice for many designs because of their high saturation and soft roll off with current. Even as application frequencies trend higher, powder cores continue to be the right answer in many cases. Optimized high frequency performance is essential, but “high frequency” means different things to different people. It could be 50 kHz, or 3 MHz, or anything in between.
To meet the need for better overall efficiency and size across the whole range of frequencies, Magnetics has developed new materials and improved on existing ones, with more to come. In this session, the leader of Magnetics’ R&D team will explain these new materials and what is coming in the pipeline.
Magnetics Tuesday, March 19, 2019-2:15PM-2:45PM
Improving Power Module Thermal Design & Reliability with IGBT Testing & Automatic Calibration of Simulation Models Andras Vass-Varnai, Joe Proulx For compact design of power electronics modules, thermal management at component to module level must be evaluated for optimal performance and reliability. This presentation introduces a study of multiple thermal measurements of IGBT power semiconductors within a power module, followed by calibration of detailed compact thermal models for use in improving the system level electronic cooling simulation accuracy of the module.  This approach combines use of Simcenter T3STER thermal transient measurement technology for heat flow path analysis and thermal reliability assessment respectively in conjunction with automatic detailed package model calibration and subsequent system level thermal simulation possible with Simcenter Flotherm software. Mentor, A Siemens Business Tuesday, March 19, 2019: 3:45PM-4:15PM
Improving Safety & Reliability for Power Electronics   Mr. Kian Sanjari – Marketing and Training Manager Session presents Mersen’s commitment to develop industry leading technologies to improve efficiency and reliability of power electronics equipment. Key topics include an Overview of High Speed Protection Fuses and innovative hybrid DC overcurrent protection devices for EV/EES applications. We will explain how Air and Liquid Cooling solutions provide thermal protection for semiconductor components and that efficient cooling is key to long term reliability and performance of fast switching semiconductor components. We will also present how Laminated bus bars provide the most efficient connection between various components, thus limiting parasitic inductance, improving ease of assembly and integration while minimizing wiring errors and costs. Mersen Tuesday, March 19, 2019-3:00PM-3:30PM
Dual-core DSCs for Digital Power Conversion Tom Spohrer Low-cost digital signal controllers (DSCs) that contain multiple processing cores add a new dimension for system partitioning in digital power applications. This session will highlight the features of Microchip’s new dsPIC33CH family of dual-core DSCs and discuss various use cases for multi-core controllers. Microchip  Tuesday, March 19, 2019- 1:30PM-2:00PM
The LV100 and HV100 New Standard Modules for High Power Applications Eric R. Motto,  Chief Engineer – Power Semiconductor Applications This presentation will introduce the LV100 and HV100 new industry standard module packages for high power applications.  Existing high power single modules in common 130mm x 140mm and 190mm x 140mm packages introduce a large stray inductance when series connected to form an inverter leg.  This large inductance makes higher frequency operation and parallel connection challenging.  Similarly, common large dual modules in 89mm x 250mm and 89mm x 172mm packages have significant internal asymmetries that cause undesirable current and temperature imbalance when the switching speed is increased.  These problems become more pronounced with state of the art IGBT chips like Mitsubishi’s 7th generation CSTBTTM (III) and practically unmanageable with SiC MOSFETs.  Elimination of these limitations is the primary motivation for development of new high power modules having low and symmetric internal inductance with an optimized power terminal layout.  This presentation will outline the characteristics, features, performance and line-up of these new modules. Mitsubishi Electric US, INC Tuesday, March 19, 2019-2:15PM-2:45PM
Silicon Carbide… A brief overview: Where we are, Where we’re headed, and Tips for Successful Use. Mitch Van Ochten | Applications Engineer Silicon Carbide continues to evolve but evolution also brings new challenges.    We will take a look at the advancement in die size reduction, new packages with Kelvin connections, 4th Generation SiC roadmap and our new 1700V 250A Power Module that provides the industry’s highest level of reliability while maintaining energy-saving performance.  When integrating these new packages, there are many factors you should consider and we will provide guidance on choosing a Gate Driver, picking the DC/DC converter for the secondary side, minimizing stray inductance and checking for overshoot on the Gate voltage to optimize the design. Mouser Tuesday, March 19, 2019-2:15PM-2:45PM
What are you waiting for? Let’s go GaNFast! Stephen Oliver, VP Sales & Marketing GaN has entered high-volume, mainstream production. End-customer products and roadmap applications from 24W to kW+ are highlighted. Then a 45W USB-PD fast-charger case-study details high-frequency GaNFast power IC technology, qualification ‘beyond JEDEC’, system schematic and layout, plus thermal and EMI (CE, RE) results. Discover how to become a GaNFast Design Partner! Navitas Semiconductor Tuesday, March 19, 2019- 1:30PM-2:00PM
Battery Emulation for Powertrain & DC Fast Charger Testing Martin M Weiss – Product Director There are new testing challenges for Battery Electric Vehicle’s powertrain components and DC Fast Chargers that can be addressed with modern battery emulation solutions.  BEV’s vehicle propulsion components and the DC Fast Chargers (CCS1, CCS2, & CHAdeMO) are designed to operate at 400VDC or at a newer 800VDC level.   NHR will present our modular 600VDC/1200VDC Dual-Range Battery Emulator which is ideally suited for testing of powertrain components, complete skateboards and electric fueling systems.  We invite you to come see how Battery Emulation is the right approach for faster, scalable and more repeatable testing of new automotive power electronic components.   NH Research Wednesday, March 20, 2019-10:30AM-11:00AM
New Small Li-Ion  Rechargeable Batteries in a Capacitor Package Mark Gebbia Nichicon is introducing a new product segment, the Small Lithium Ion Rechargeable Battery. The batteries bridge the gap between standard Lithium ion batteries and EDLC’s. They have better energy capabilities than EDLC’s and higher power characteristics than rechargeable Li-ion batteries.  They are available in case sizes as small as 3x7mm and energy densities reaching 39 Wh/kg. These batteries are safer than conventional Li-ion batteries even at charge/discharge rates of 20C and do not ignite from shorting internally.  Come and see us for more information and stop by Booth 665 for details.  Nichicon (America) Corp Tuesday, March 19, 2019: 3:45PM-4:15PM
Satisfying the  pressured designer's wish list with all the right tools in just one toolbox Dave Priscak The modern electronics designer often has to be a jack of all trades - in SMEs and even mid-sized OEMs, he or she may need to design and develop solutions in analog or digital and effectively deal with challenging areas such as EMI, RFI and thermal management. This is a tough ask, made all the more difficult in an environment where available technology continues to move at a fast and exciting pace, enabling the ever-more diverse and amazing stream of end products that consumers and industry alike have grown used to having access to, but meaning the engineer is on a continuous learning curve. The final consideration to throw into the mix is time pressure - the fast moving technological environment means getting new ideas to market quickly is key to gaining market share and generating revenues from often short-lived USPs.  All of this creates a comprehensive wish list from the pressured engineer. This article looks at the key items on such a notional list and considers how the tools, resources and information in the sector can help satisfy them.  ON Semiconductor  Tuesday, March 19, 2019- 1:30PM-2:00PM
Real-Time Simulation: Helping the World Build Better Products Martin Belanger
Director, Sales, North America
martin.belanger@opal-rt.com
For nearly 20 years, OPAL-RT has conducted extensive research and development in the field of power electronics, in order to deliver the fastest and most accurate real-time simulation. OPAL-RT platforms for testing and validation of electronic controls cover a wide range of applications, from renewable energy conversion to highly complex multi-modular converters (MMC) and the electric motors of tomorrow’s transportation industry.
By combining precise expertise, experience and mathematical innovation, OPAL-RT has succeeded in creating the market’s fastest computing level for real-time simulation on FPGA for power electronics applications. Fast real-time simulation achieves more accurate results and increases HIL and RCP test coverage, and now pushes back the boundaries of what is achievable with PHIL applications.
OPAL-RT TECHNOLOGIES Wednesday, March 20, 2019-10:30AM-11:00AM
High Reliability Soft Magnetic Powder for Automotive Inductors Yoshizawa Masahito High reliability under sever conditions like engine rooms is required in automotive inductors. We introduce brand-new insulated soft magnetic powder for the automotive inductors by our original insulation technology. The key factor is stability under thermal aging conditions at 150C for 1000 hours with higher heat resistance and lower hygroscopicity than our conventional technologies. The insulation treatment is available for all our powders. Pacific Sowa Corp C/O Epson Atmix Corp Tuesday, March 19, 2019: 3:45PM-4:15PM
X-GaN Power Transistor Breakdown Mechanisms Tom Higuchi GaN, which surpasses Si by performance, is increased its expectation as a next generation device.
The high performance of GaN has already been proved in many parties. So how about destruction?
The most important performance of Power Device is breakdown capability, GaN breakdown mechanisms will be clear in this seminar.
Panasonic Tuesday, March 19, 2019-3:00PM-3:30PM
Delay, rise-time and slew rate using CWT HF optimised Rogowski current sensors in Power Electronics' Dr Chris Hewson PEM's CWT range of Rogowski current sensors have been used in power electronic applications for over 25 years. Improvements in bandwidth for the new CWTHF ranges of Rogowski current sensors from PEM Ltd have opened up new application areas including measurements in SiC semiconductors. Understanding the limitations of high frequency bandwidth and how this relates in practice to rise-time, slew rate and delay of these new faster probes is discussed and illustrated with practical measurement examples. PEM Ltd Wednesday, March 20, 2019-11:15AM-11:45AM
Code Generation and Real-time Simulation with PLECS and the RT Box Bryan Lieblick Powerful new tools such as automatic code generation and hardware-in-the-loop testing are key to accelerating the design, programming, and validation of embedded control systems.  In this seminar we will transform a PLECS simulation model of a power stage and controller into a real-time test of an embedded control system.  We will showcase how to generate control code for a TI C2000 microprocessor from PLECS, and then verify the deployed control code using the PLECS RT Box in a HIL test bed.  We will benchmark offline and real-time simulations, demonstrating how embedded controls can quickly be developed and tested in real-time using the PLECS toolchain. Plexim Wednesday, March 20, 2019-11:15AM-11:45AM
Death to Heatsinks Doug Bailey- Vice President of Marketing
Examine most consumer product power supplies and you will find at least one heatsink. Generally, they are made out of a piece of extruded or stamped copper or aluminum. The heatsink’s job is to couple wasted energy into the ambient environment, where it can’t do any harm. Think about the concept of “wasted energy”. Who says it’s waste? Who says that it’s OK to dispose of it and why is it wasted in the first place? In an age where advanced materials and sophisticated controller techniques abound, isn’t it time for a rethink? Consider instead that the existence of a heatsink in a product represents a quantum of failure: Failure of our society to efficiently manage our energy resources, failure of our designers to specify products that are compact, light and unobtrusive and a failure of project definition experts to leverage the technologies that are readily available. As an industry, we are continuously tempted to sacrifice energy, product utility and cost of ownership for unit cheapness, passing the electricity bills onto the end user and wasting resources. This presentation is an unabashedly partisan attack on the practice of heatsinking, along with a review of the materials and techniques that we can, as engineers, leverage now and in the future to make better products. Death to Heatsinks!!!
Power Integrations Wednesday, March 20, 2019-10:30AM-11:00AM
Factors in Selecting Programmable AC Power Sources Brian Hsu Many industrial and commercial applications in factory, research labs, and military need AC power sources with programmable voltage and frequencies for accomplish the testing procedures or requirements. Therefore it is important to understand different types of power sources, advantages, and key parameters when doing the selection for the applications. The presentation will start with a brief history of the technology, then go into explaining the difference between various designs, their requirements as well as advantages/disadvantages. Illustrations will be provided. Preen AC Power Corp. Wednesday, March 20, 2019-11:15AM-11:45AM
Novel Two-stage Bucks Achieve Unprecedented Efficiency in Ultra-low Profile and Footprint for Powering DDR5 Memory, ASICs and FPGAs Stephen Allen Based on a patented architecture originating from MIT, pSemi is releasing a new family of DC-DC buck converters featuring a unique two-stage architecture that dramatically reduces the dependency on inductors, improves conversion efficiency and transient performance, and yet reduces solution footprint and profile.
Targeting applications such as DDR5 memory, ASICs and FPGAs, the products are being released as both discrete component form, and as fully integrated modules.  The latter benefit from the dramatic reduction in inductor size, allowing the use of advanced 3D semiconductor packaging technologies to achieve the world’s smallest and most efficient fully integrated products on the market.  
pSemi, A Murata Company Wednesday, March 20, 2019-11:15AM-11:45AM
Magnetics Modeling And Software Dr. Ray Ridley In this session, Dr. Ridley will show how magnetics structures can be quickly and accurately translated into LTspice models. The modeling techniques allow engineers to take their magnetics design to the next level. Powerful software algorithms solve for advanced proximity losses, giving far more accurate estimations of magnetics winding loss. The winding loss models will automatically adapt to the current waveforms seen by any given topology. 
For the first time, we also show how magnetics core loss can be incorporated into LTspice models for a given core and winding arrangement. The equivalent circuit models react to changing duty cycles and frequency components, automatically showing how the core loss changes. The reduction in development time is substantial.
Ridley Engineering, Inc. Tuesday, March 19, 2019: 3:45PM-4:15PM
Curamik ceramic substrates and laminated busbars solutions for Power Electronics Dominik Pawlik & Olivier Mathieu  Introduction to ceramic substrates and laminated busbars solutions from Rogers Corporation.  Rogers Corporation Tuesday, March 19, 2019-3:00PM-3:30PM
Oscilloscopes: An all-in-one solution for power electronics design  - From switching and frequency response analysis to EMI debugging Mike Schnecker Oscilloscopes are the work horse for power electronics engineers. With frequency response analysis functionality and fast and convenient FFT capabilities available, they become a multi-purpose instrument for power electronics engineers. This talk covers key topics of interest for power electronics engineers: Bode plot functionality, switching analysis and EMI debugging. Rohde & Schwarz Wednesday, March 20, 2019-12:00PM-12:30PM
Optimal DC Link Topologies for Best Utilization of Switch Modules Michael Brubaker Advanced Si and SiC switch modules require an optimized DC link to enable maximum performance.    SBE’s integrated capacitor/bus technology is ideally suited for obtaining very low ESL and paralleling multiple half-bridges. Examples of next generation switch modules combined with ring capacitor windings surface mounted to low inductance bus structures are provided. This approach allows for the highest possible Ampere per micro-Farad rating of the DC link along with the lowest possible commutation loop inductance.    Lowering the total ESL is critical to increase the operating voltage for improved efficiency and the best utilization of switching devices.               SBE, Inc. Tuesday, March 19, 2019: 3:45PM-4:15PM
Advanced Solutions for Energy Storage and Heat Dissipation Issues in Power Electronics Dr. Sandra Reisinger The composite, Aluminium Graphite (ALG), has a low density paired with a high thermal conductivity and low coefficient of thermal expansion. This makes it the ideal thermal management material for high-reliability RF, power and microelectronics applications. Schunk produces a wide range of customized parts with different plating options in various quantities. Furthermore, ALG soldering jigs and fixtures can be produced far much more sophisticated features compared to conventional graphite jigs and offer the advantage of higher durability.
Our innovative phase change composite, Latent Heat Carbon, allows for effective buffering of temperature peaks as well as energy storage. Its unique production process allows for custom designs at attractive cost with optimal thermal properties tailored to each customer’s specific needs. Applications range from battery thermal management and climate control/HVACs in vehicles to electronics cooling.
Schunk Carbon technology GmbH Tuesday, March 19, 2019: 3:45PM-4:15PM
 Hybrid SiC Modules Optimized for Converter and Inverter Operations Kevork Haddad The presentation will provide background of adding SiC diodes in power modules. Hybrid modules are a viable approach for medium to high power applications. However, converter and rectifier operations require different chip optimization due to different duty cycles in two level topologies. This optimization is necessary from the cost point of view due to high material cost of SiC.
The presentation will give an overview of the SKiM platform. Also, it will pinpoint how freewheeling diode are stressed during converter or inverter operations. It will also introduce two newly developed and qualified hybrid SKiM modules that addresses the above concerns. Further, a perfect IGBT-SiC diode pairing is achieved by replacing medium speed IGBTs with high speed chips. Performance of the new hybrid modules are compared to their Si based counterpart by way of examples and benefits are highlighted.
SEMIKRON Inc Wednesday, March 20, 2019-10:30AM-11:00AM
SIMPLIS Magnetic Design Module and User C-code DLL Defined Digital Device John Wilson and Andrija Stupar A digitally controlled PFC boost converter is modeled in SIMPLIS with the control algorithm defined by a user-generated C-code DLL.  Placed on the schematic like any other SIMPLIS component, the device behavior is defined by C or C++ code rather than by logic gates and other digital circuit elements.
We then design the boost inductor and analyze its performance using the new SIMPLIS Magnetics Design Module – step-by-step, selecting the core, wire, winding arrangement, and cooling method.  Results include core losses, detailed winding losses (including losses due to the air gap fringing flux), the inductance characteristic, and core and winding temperatures.
SIMPLIS Technologies Tuesday, March 19, 2019-2:15PM-2:45PM
Advanced Manufacturing of GaN for Power Devices Joe Lu Sino Nitride Semiconductor (SNS) was founded in 2009 as a GaN materials and service company.  By introducing two new technologies, the laser lift-off and wet aching, high quality 2-inch bulk GaN wafer with dislocation density of 5×105 cm-2 can be achieved by vertical HVPE epitaxy. The HVPE batch reactor was designed to produce 2/4/6 inch GaN substrates at high throughput and low particulates. The deposition rate can be controlled from 2 to 100µm/hr. The quality of the GaN reveals the FWHM of 39.9 arcsec and 47.5 arcsec at (002) and (102) rocking curves respectively, indicating their high degree of crystalline stoichiometry. In addition, SNS launched 4-inch free-standing GaN substrates with dislocation density below 5×106cm-2 in 2018. HEMT devices have been built to verify the material integrity in handling the high power environment. Sino Nitride Semiconductor Wednesday, March 20, 2019-12:00PM-12:30PM
HIL Testing and Controls for Power Electronics Made Easy with Speedgoat Real-Time Solutions Daniel Kraehenbuehl Simulink Real-Time and HDL Coder, together with Speedgoat real-time systems, create a complete and seamless integrated real-time software and hardware environment for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) simulation. Simulink Real-Time provides a high-performance host-target prototyping environment that enables you to connect your Simulink/Simscape models to physical systems either running C code on a CPU and/or HDL code on an FPGA. Speedgoat offers a wide band of optimized hardware sufficiently equipped with high speed analog and digital inputs and outputs. Verifying and testing the control hardware with its embedded software against a virtual prototype of the controlled system using deterministic and equivalent real-time simulation is a proven step before proceeding to prototype hardware testing. In HIL testing, power electronics, power stages, sources, loads, and even a grid network are simulated in system-level models running on dedicated real-time test systems. The system lets you perform initial testing of embedded software without risking damage to hardware prototypes and develop a high degree of confidence that your software will perform its intended functions. Advances are being made to real-time test hardware through the incorporation of FPGAs, for high speed I/O and for running the simulation, the latter presenting a new challenge of programming over the more common use of C code on a microprocessor. Speedgoat Inc. Wednesday, March 20, 2019-12:00PM-12:30PM
Flexible Architectures to Efficiently Convert from 48V to Intermediate Bus or Directly to POL Paolo Sandri 48V DC bus power distribution poses challenges on conversion efficiency, power density and total BOM optimization. ST offers a rich set of architectures to better fit, virtually, any need when converting from 48V to either an intermediate bus or directly to POL.  The architectures for the intermediate bus can either provide a regulated output or an unregulated one.
The 48V direct conversion architectures delivers power directly to the Digital ASIC, whose cores typically requires several hundred Watts and other key challenges needs to be addressed such as the compliance with the specific ASIC power needs with a certain degree of sophistication in term of accuracy and mode of operations.
STMicroelectronics Tuesday, March 19, 2019-2:15PM-2:45PM
Isolated Gate Drivers – how do I know which ones right for my application? Nagarajan Sridhar This seminar discusses the value of the isolated gate driver and explains how to pick the right isolated gate driver for high-power, high-voltage applications. Additionally, this seminar explores various functionality requirement modifications needed for applications trending toward the adoption of wide bandgap power devices such as SiC and GaN. Texas Instruments Tuesday, March 19, 2019-2:15PM-2:45PM
OPB9000 and Adaptable Sensors: Trends, Challenges and Developments Sergey Komarov Modern day sensors applications in portable medical devices, wearables, appliances, drones and autonomous vehicles pose new challenges for product designers and sensors developers. While the traditional purpose of optical sensors as motion or position transducers for non-contacting object sensing fundamentally has not changed, the variety of environments in which they operate and demand for portability in a data driven world place new requirements for sensors to become highly integrated and dynamically adaptable.  The OPB9000 reflective optical sensor from TT Electronics is one such device. It integrates an infrared (IR) emitter and a photodetector in one package, along with the analogue front-end circuitry, on-chip processing, and a digital interface in a surface-mount package of 4.0 × 2.2 × 1.5 mm. The circuitry is encapsulated in industrial resin, making it robust and able to operate at temperatures from –40 to +85 °C. In this session we will review the main trends, challenges and developments associated with adoptable sensors and their implementation in OPB9000.   TT Electronics Tuesday, March 19, 2019-3:00PM-3:30PM
Ultra-High Fidelity Real-Time Simulation for Power Electronics and Microgrids Bozica Kovacevic Typhoon HIL Inc. is  the market and technology leader in the rapidly-growing field of ultra-high-fidelity controller-Hardware-in-the-Loop (C-HIL) simulation for power electronics, microgrids, and distribution networks. We provide industry-  proven, vertically integrated test solutions along with highest-quality customer support. The company was founded in 2008 and since then has been creating products distinguished by the ultimate ease of use, unrivaled performance, leading-edge technology, and affordability. We stand behind our seamlessly integrated technology stack, from Typhoon HIL’s application specific processors and ultra-robust numerical solver all the way to the schematic editor and SCADA system. The complete technology stack that empowers our customers to continuously exceed  their controller software quality, performance, and time-to-market goals. Typhoon HIL Inc. Wednesday, March 20, 2019-10:30AM-11:00AM
Advanced capacitor technology for automotive applications Derrick Fitzpatrick Updated hybrid capacitor series for high power DC link and also latest technology products line up will be presented.                                                                  United Chemi-Con, Inc. Tuesday, March 19, 2019-2:15PM-2:45PM
Pioneering Performance for Practical Power Purposes     Vishay Tuesday, March 19, 2019- 1:30PM-2:00PM
Challenges of Magnetic Component Core and Copper Loss Measurement Weyman Lundquist Isolation of magnetic core and winding loss in a transformer or inductor from small signal measurements can prove a challenging task. The device under test must be evaluated before performing a test, to discern if it is in a range where it can be accurately measured, or if simulation is a better choice for estimating loss. If a small signal measurement is chosen to estimate loss, the results must be interpreted carefully. In this talk, we present measurement ranges in which winding and core loss can be extracted from a small signal impedance analyzer measurement, and a method for doing so when extraction is feasible. West Coast Magnetics Wednesday, March 20, 2019-12:00PM-12:30PM
Avoid Designing Custom Magnetics by using REDEXPERT George Slama Designing your own custom magnetics may seem like a good idea at first. After all, you’ll get exactly what you want. But will you? Consider the time and effort that first goes into some type of design and then into procuring the necessary cores, bobbins, wire and later into actually winding and gapping the core. This also requires equipment since only the simplest inductors can be made by hand. The best performing magnetics generally use techniques (e.g. rectangular wire wound on edge) and materials (e.g. pressed composites) not available outside of manufacturing facilities.
This session will show you why it makes sense to use standard magnetic components and how to take advantage of the wealth of performance information available to help verify your design. Based on actual testing, REDEXPERT gives you access to the world’s most accurate ac loss measurements for inductors. Discover the broad of range of solutions available for next day delivery. Learn how to easily and quickly select the right inductor, flyback transformer or wireless power transfer coil for your application.
Wurth Electronics Tuesday, March 19, 2019- 1:30PM-2:00PM
The Next Generation in Power Measurement Daniel Kasamis – Product Marketing Manager – Power Analyzers The WT5000 is the Next Generation in Precision of Yokogawa’s Power Analyzers product line. It is a versatile platform that delivers extraordinary precision and exceptional performance for the most demanding applications. Equipped with 7 user swappable and reconfigurable input elements plus 4 motor channels, the WT5000 is an ideal instrument for both electrical and mechanical power and efficiency measurements. Its highly responsive touchscreen, intuitive menu operations, and out of the box software solution make the WT5000 an ideal instrument for your testing needs. We will be highlighting key applications for motor and drive development, renewable energy, and inductive charging.   Yokogawa Tuesday, March 19, 2019-2:15PM-2:45PM