Thursday, February 9, 11:30 am - 1:30 pm

Title

Author(s)

Electromigration Study on the Interconnects of High Density Power Modules

Yakup Bulur, Rick J. Fishbune, Michael A. Vaughn, Jerry Fitzpatrick...

A Comprehensive Analytical and Experimental Investigation of Wire Bond Life for IGBT Modules

Yan Chen, Xin Wu, Igor Fedchenia, Mikhail Gorbounov, Vladimir Blask...

Development of a Predictive Observer Thermal Model for Power Semiconductor Devices for Overload Monitoring in High Power High Frequency Converters

Sumit Dutta, Babak Parkhideh, Subhashish Bhattacharya, Giti Karimi ...